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Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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TCC1206X7R104M500DT 是一款由 CCTC(三环)公司生产的贴片多层陶瓷电容(MLCC),广泛应用于各种电子设备中。该电容具有高可靠性、优异的电气性能和稳定的温度特性,适用于多种电路设计需求。
3.1 容值与精度 TCC1206X7R104M500DT 的标称容值为 100nF,精度为 ±20%。这意味着在实际应用中,电容的容值可能在 80nF 到 120nF 之间波动。这种精度范围适用于大多数通用电路设计,尤其是在对容值要求不特别严格的场合。
3.2 材质与温度特性 该电容采用 X7R 材质,具有较好的温度稳定性。X7R 材质的温度系数为 ±15%,在 -55°C 到 +125°C 的温度范围内,容值变化不超过 ±15%。这使得 TCC1206X7R104M500DT 能够在较宽的温度范围内保持稳定的电气性能,适用于各种环境条件下的应用。
3.3 额定电压 TCC1206X7R104M500DT 的额定电压为 50V,这意味着在正常工作条件下,电容可以承受的最大电压为 50V。在实际应用中,建议工作电压不超过额定电压的 80%,以确保电容的长期可靠性和稳定性。
3.4 封装尺寸 该电容采用 1206 封装,尺寸为 3.2mm x 1.6mm。这种封装尺寸在贴片电容中属于中等大小,既便于自动化生产中的贴装,又能在有限的空间内提供足够的容值。
TCC1206X7R104M500DT 广泛应用于各种电子设备中,包括但不限于:
TCC1206X7R104M500DT 由 CCTC(三环)公司生产,该公司在电子元器件领域具有较高的声誉和丰富的生产经验。CCTC 的产品以高质量、高可靠性和优异的性能著称,广泛应用于全球各地的电子设备中。
TCC1206X7R104M500DT 是一款性能优异、应用广泛的贴片多层陶瓷电容。其 100nF 的容值、±20% 的精度、50V 的额定电压以及 X7R 材质的温度稳定性,使其成为各种电子设备中的理想选择。无论是电源管理、信号处理还是通信设备,TCC1206X7R104M500DT 都能提供稳定可靠的电气性能,满足不同应用场景的需求。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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