WMSIC Electronic Components

CCTC TCC1206X7R104J500DT

ModelTCC1206X7R104J500DT
Package1206
BrandCCTC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

13 specifications

Core information

Product name
CCTC TCC1206X7R104J500DT
Type
CCTC
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CCTC
Electronic Component
TCC1206X7R104J500DT
Electronic Component
1
Package
1206
Electronic Component
0.045g
Electronic Component
1
Electronic Component
BM0264907441
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TCC1206X7R104J500DT 贴片电容(MLCC)产品概述

TCC1206X7R104J500DT是CCTC三环电子推出的通用型多层陶瓷贴片电容(MLCC),针对中低压电路的滤波、去耦、耦合等核心应用设计,兼顾性能稳定性与成本优势,广泛适配工业控制、消费电子、通信设备等领域。

一、产品基本定位

该型号属于三环电子常规MLCC产品线,聚焦通用场景——既满足多数电路对容值、精度的基础需求,又通过X7R陶瓷材质实现宽温适应性,避免了高精度材质(如NPO)的成本溢价,是替代进口同类产品的高性价比选择。

二、核心性能参数解析

产品参数严格遵循行业标准,核心指标如下:

  1. 容值与精度:标称容值100nF(对应代码“104”,即10×10⁴pF),精度±5%(代码“J”),可满足多数电路对容值偏差的容忍要求;
  2. 额定电压:直流额定电压50V,AC应用需按1/√2降额(约35VAC),适合12V/24V等低压电源的滤波场景;
  3. 温度系数:X7R材质(EIA标准),工作温度范围-55℃~+125℃,容值变化控制在±15%以内,宽温环境下性能稳定;
  4. 封装尺寸:1206英制封装(公制3.2mm×1.6mm),厚度约0.8mm,适配自动化贴装产线,兼容常规PCB设计。

三、封装与工艺特性

1206封装采用端电极+陶瓷介质结构,两端电极镀镍锡合金,具备良好的焊接兼容性:

  • 回流焊温度曲线需控制在260℃以内(峰值),避免陶瓷介质开裂;
  • 符合RoHS 2.0环保标准,无铅无卤,满足出口及高端产品要求;
  • 机械强度适中,可通过振动、冲击测试(符合IEC 60068标准),适合车载、工业等振动环境。

四、典型应用场景

结合参数特点,该型号主要应用于以下场景:

  1. 电源滤波:DC-DC转换器输入/输出滤波、线性电源稳压后滤波,降低纹波噪声;
  2. 数字电路去耦:MCU、FPGA、DSP等数字芯片的电源引脚去耦,抑制高频噪声;
  3. 工业控制电路:PLC、传感器模块的信号耦合/滤波,适配-40℃~+85℃的工业环境;
  4. 消费电子:显示器、机顶盒、智能家居设备的电源模块,平衡性能与成本;
  5. 通信设备:小型基站、路由器的射频前端滤波,兼顾宽温与容值密度。

五、品牌可靠性保障

CCTC三环电子是国内MLCC领域的头部企业,产品通过多项权威认证:

  • 质量体系:ISO 9001质量管理体系认证;
  • 可靠性测试:温度循环(-55℃~+125℃,1000次)、湿度老化(85℃/85%RH,1000h)、耐电压测试(1.5倍额定电压,1s);
  • 一致性:批量产品容值偏差控制在±5%以内,批次间性能稳定。

六、使用注意事项

为确保产品长期可靠工作,需注意以下要点:

  1. 电压降额:建议实际工作电压不超过40V(额定电压80%),避免过压击穿;
  2. 温度限制:超出-55℃~+125℃范围时,容值变化可能超过15%,需重新评估;
  3. 贴装工艺:避免手工焊接时烙铁温度过高(>300℃),防止电极氧化或介质损坏;
  4. 精度匹配:若需±1%高精度或低损耗(如射频电路),需替换为NPO材质的同类产品。

该型号凭借高性价比、宽温适应性与稳定可靠性,成为中低压通用电路的主流选型之一,可直接替代村田GRM1885C1H104JA01D、三星CL21B104JAFNNNE等进口型号。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.