Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TCC1206X7R151K102DTS是CCTC(三环电子) 推出的高压型贴片多层陶瓷电容(MLCC),型号各部分含义明确:
该产品定位于高压、中等温度稳定性的基础元器件,适配多场景工业与商业应用。
TCC1206X7R151K102DTS的关键参数符合行业标准,具体如下:
参数项 规格值 备注 封装形式 1206(3216公制) 表面贴装,无引脚设计 容值 150pF(151) 标准容值编码 精度 ±10%(K级) 工业级常用精度 额定电压(DC) 1kV 直流工作电压上限 温度系数 X7R -55℃~+125℃,ΔC/C≤±15% 损耗角正切(tanδ) ≤1.5%(1kHz,25℃) 典型值,随频率略有变化 尺寸 长3.2±0.2mm,宽1.6±0.15mm,厚0.8±0.1mm 封装一致性符合IPC标准 焊接温度 回流焊峰值260℃±5℃(持续≤10s) 无铅焊接兼容,手工焊需控制温度≤350℃(时间≤3s) 环保认证 RoHS 2.0、REACH 符合欧盟环保要求X7R是MLCC中应用最广泛的材质之一,相比其他材质具有平衡优势:
针对该产品,X7R材质确保了宽温范围内容值漂移小,可稳定工作于工业环境。
该产品凭借1kV高压、150pF容值与X7R的平衡性能,广泛应用于:
CCTC(三环电子)是国内MLCC主流供应商,TCC系列产品具有以下优势:
为确保性能与寿命,使用时需注意:
该产品凭借高压能力、稳定性能与高性价比,是工业与商业领域高压电路设计的优选元件。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products