WMSIC Electronic Components

CCTC TCC0603COG140J500CT

ModelTCC0603COG140J500CT
Package0603
BrandCCTC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
CCTC TCC0603COG140J500CT
Type
CCTC
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CCTC
Electronic Component
TCC0603COG140J500CT
Electronic Component
1
Electronic Component
14pF
Package
0603
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±5%
Electronic Component
0.035g
Electronic Component
1
Electronic Component
BM0264458210
Electronic Component
C0G
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TCC0603COG140J500CT 贴片多层陶瓷电容(MLCC)产品概述

TCC0603COG140J500CT是三环电子(CCTC) 推出的高性能贴片多层陶瓷电容(MLCC),属于C0G(NP0类)超稳定系列,采用0603英制封装(对应公制1608),专为高频、精密电子电路设计,兼具小型化与高可靠性优势。

一、产品基本信息

该型号电容为无极性贴片元件,核心标识解析清晰:

  • TCC:三环电子品牌代码;
  • 0603:英制封装尺寸(长0.06英寸×宽0.03英寸,约1.6mm×0.8mm);
  • COG:温度系数代码(对应NP0,超稳定型介质);
  • 140:容值代码(14×10⁰=14pF);
  • J:精度等级(±5%,EIA标准);
  • 500:额定电压(50V DC);
  • CT:三环标准系列尾缀。

二、核心性能参数

参数项 规格值 关键说明 标称容值 14pF 多层陶瓷介质的稳定电容值 容值精度 ±5%(J级) 满足一般精密电路的精度要求 额定电压(VR) 50V DC 持续工作的最大安全电压 温度系数 C0G(NP0) 温度变化对容值影响≤±30ppm/℃ 工作温度范围 -55℃ ~ +125℃ 宽温环境下性能稳定 损耗角正切(tanδ) ≤0.15%(1kHz, 25℃) 高频信号损耗极低 封装尺寸 0603英制(1.6mm×0.8mm) 适配高密度PCB布局

三、关键特性分析

1. 超稳定温度特性

C0G类介质是目前容值温度稳定性最优的类型之一,在**-55℃至+125℃** 范围内,容值变化率≤±0.03%,远优于X7R等温度补偿型介质,可有效避免温度波动对电路性能的干扰。

2. 低损耗与高Q值

该电容在1MHz~2GHz高频段仍保持低损耗(tanδ≤0.2%),Q值(品质因数)可达数百,适合射频、微波电路中对信号完整性要求高的场景(如滤波器、振荡回路)。

3. 高可靠性与长寿命

采用多层陶瓷叠层工艺,无液态电解质,耐机械冲击与振动;符合RoHS 2.0、REACH 环保标准,部分批次通过AEC-Q200汽车级认证,可满足工业级、消费电子及汽车电子的长期稳定运行需求。

4. 小型化高密度集成

0603封装体积小(约1.6mm×0.8mm×0.8mm)、重量轻(≤0.01g),可显著提升PCB集成密度,适配智能手机、可穿戴设备等小型化产品。

四、典型应用场景

  1. 射频/微波通信:基站射频前端、手机5G/4G模块、Wi-Fi 6/6E电路,用于滤波、耦合、匹配网络;
  2. 精密模拟电路:运算放大器反馈回路、有源滤波器、ADC/DAC参考电路,保证信号精度;
  3. 高频振荡电路:晶体振荡器(XO)、压控振荡器(VCO)、锁相环(PLL),避免温度导致的频率漂移;
  4. 汽车电子:车载导航射频模块、传感器信号调理电路(50V额定电压满足部分低压场景);
  5. 消费电子:智能手机音频模块、平板电脑射频天线、智能手表传感器电路。

五、安装与存储注意事项

1. 焊接规范

  • 回流焊:峰值温度245℃±5℃,时间≤10秒,升温速率≤3℃/s;
  • 手工焊:烙铁温度≤350℃,焊接时间≤3秒,避免过热损伤介质;
  • 无极性安装:无需区分正负极,安装方向无限制。

2. 存储与防护

  • 未开封产品:存储于15℃~35℃、湿度≤60%的干燥环境,保质期12个月;
  • 静电防护:操作时佩戴ESD手环/手套,避免静电击穿;
  • 机械应力:焊接后勿施加过度弯曲、拉伸力,防止陶瓷层开裂。

该型号电容凭借稳定性能、小型化设计与高可靠性,成为精密电子领域的常用选择,可满足从消费电子到工业级应用的多样化需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.