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TCC0201X5R473K250ZT是三环电子(CCTC) 推出的通用型多层陶瓷电容(MLCC),采用0201英制表面贴装封装,定位中低电压、常规容量的基础电子元件,广泛应用于消费电子、通信设备等领域的滤波、耦合、旁路电路。
型号命名规则清晰体现核心参数:
该型号参数精准匹配通用电路需求,具体如下:
参数项 具体数值 说明 标称容值 47nF(473pF) 1nF=1000pF,47×10³pF=47nF 容值精度 ±10%(K档) 满足大多数滤波、耦合电路的容量误差要求 额定电压 25V DC 适用于低中压电路,避免过压击穿 温度系数 X5R(EIA标准) 工作温度-55℃~+85℃,容值变化≤±15% 封装尺寸 0201英制(0.6mm×0.3mm) 厚度≈0.3mm,小型化适合高密度贴装 介质类型 多层陶瓷介质 叠层工艺实现高容量密度,寄生参数低 环保标准 RoHS/REACH compliant 无铅无镉,符合欧盟环保要求X5R温度系数是该型号的核心优势之一,相比Y5V等低成本电容,稳定性显著提升:
0201封装体积超小(约0.18mm²贴装面积),重量仅0.01g,具备以下优势:
该型号广泛用于以下领域:
⚠️ 注意:不适合高压(>25V)、极端高温(>85℃)或GHz以上高频场景。
三环电子(CCTC)是国内MLCC领域的主流厂商,具备以下质量优势:
TCC0201X5R473K250ZT作为一款小型化、稳定可靠、性价比高的通用MLCC,精准覆盖消费电子、通信、工业控制等领域的基础电路需求,是电子工程师选型时的常用元件之一。其X5R温度特性、0201封装优势及三环的质量保障,使其在同类产品中具备较强竞争力。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
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The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
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The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
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Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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