Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
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TCC1206X7R102K101DT 是一款由 CCTC(三环)公司生产的贴片多层陶瓷电容器(MLCC),广泛应用于各种电子设备中。该电容器具有高可靠性、优异的电气性能和稳定的温度特性,适用于多种电路设计需求。
TCC1206X7R102K101DT 的标称容值为 1nF(纳法拉),精度为 ±10%。这意味着在实际应用中,电容值可能在 0.9nF 到 1.1nF 之间波动。这种精度适用于大多数通用电路设计,如滤波、耦合和旁路等应用。
该电容器采用 X7R 材质,具有优异的温度稳定性。X7R 材质的温度系数为 ±15%,在 -55°C 到 +125°C 的温度范围内,电容值变化不超过 ±15%。这使得 TCC1206X7R102K101DT 能够在宽温度范围内保持稳定的电气性能,适用于工业和汽车电子等严苛环境。
TCC1206X7R102K101DT 的额定电压为 100V,这意味着它可以在不超过 100V 的电压下长期稳定工作。高额定电压使其适用于高压电路设计,如电源滤波和电压调节等应用。
该电容器采用 1206 封装,尺寸为 3.2mm x 1.6mm。这种封装尺寸在贴片电容中属于中等大小,便于自动化贴装和手工焊接,适用于高密度电路板设计。
TCC1206X7R102K101DT 广泛应用于各种电子设备中,包括但不限于以下领域:
TCC1206X7R102K101DT 由 CCTC(三环)公司生产,该公司是中国领先的电子元器件制造商之一,拥有先进的生产设备和严格的质量控制体系。CCTC 的产品以高可靠性、优异的电气性能和稳定的温度特性著称,广泛应用于全球各地的电子设备中。
TCC1206X7R102K101DT 是一款高性能的贴片多层陶瓷电容器,具有 1nF 的容值、±10% 的精度、100V 的额定电压和 X7R 材质的温度特性。其 1206 封装尺寸便于自动化贴装和手工焊接,适用于各种电子设备中的电源滤波、信号耦合和旁路等应用。CCTC 公司的高质量保证使其成为工程师和设计师的理想选择。
通过以上概述,可以看出 TCC1206X7R102K101DT 在电子元器件市场中具有广泛的应用前景和优异的性能表现,能够满足多种电路设计需求。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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