WMSIC Electronic Components

CCTC TCC1206COG820J102DT

ModelTCC1206COG820J102DT
Package1206
BrandCCTC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
CCTC TCC1206COG820J102DT
Type
CCTC
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CCTC
Electronic Component
TCC1206COG820J102DT
Electronic Component
1
Electronic Component
82pF
Package
1206
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±5%
Electronic Component
0.045g
Electronic Component
1
Electronic Component
BM0265115679
Electronic Component
C0G
Voltage
1kV
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TCC1206COG820J102DT 贴片多层陶瓷电容(MLCC)产品概述

一、产品核心身份与品牌背景

TCC1206COG820J102DT是三环电子(CCTC) 推出的高性能贴片多层陶瓷电容(MLCC),专为中高压、高稳定性应用场景设计。三环电子作为国内电子元器件领域资深厂商,深耕MLCC研发生产二十余年,产品以“高一致性、强可靠性、宽温度适应性”著称,广泛覆盖通信、工业控制、医疗电子等领域。

该型号命名遵循行业通用规则:

  • TCC:三环电子产品专属代号;
  • 1206:封装规格(英制,对应公制3216,尺寸3.2mm×1.6mm);
  • COG:温度系数(NP0类,容值稳定性最优);
  • 820:容值标识(82×10⁰=82pF);
  • J:精度等级(±5%);
  • 102:额定电压标识(直流1000V,即1kV)。

二、关键电气性能参数详解

产品核心参数精准匹配中高压精密电路需求:

  1. 容值与精度:额定容值82pF,精度±5%(J级),满足振荡回路、匹配网络等对容值稳定性要求较高的设计;
  2. 额定电压:直流1kV,可承受短期过压(降额使用下可靠性进一步提升),适用于中高压电源、信号传输电路;
  3. 损耗特性:C0G介质低损耗(DF≤0.15%@1kHz),减少高频信号传输中的能量损耗,提升电路效率。

三、封装与物理特性

采用1206贴片封装,适配自动化SMT生产流程:

  • 物理尺寸:3.2mm(长)×1.6mm(宽)×1.0mm(典型厚度),体积小巧,节省PCB空间;
  • 环保合规:无铅无卤,符合RoHS 2.0、REACH等国际环保标准,满足绿色制造要求;
  • 端电极设计:镍/锡镀层,焊接兼容性强,可通过回流焊、波峰焊实现可靠连接。

四、温度系数与稳定性优势

C0G(NP0)是MLCC中温度稳定性最优的介质类型,核心优势显著:

  • 温度系数:±30ppm/℃(典型值),温度每变化1℃,容值变化仅0.0003%,几乎可忽略;
  • 老化效应:长期使用容值变化≤0.1%/1000小时,无明显老化衰减;
  • 电压系数:容值随电压波动变化极小(≤0.05%@额定电压),避免电压波动影响电路性能。

五、典型应用场景

结合参数与特性,该型号适用于以下场景:

  1. 中高压直流滤波:电源模块输出滤波、高压设备EMI滤波(如工业变频器、医疗设备电源);
  2. 高频振荡与匹配:晶振负载电容、射频(RF)电路阻抗匹配(如通信基站、卫星导航设备);
  3. 精密信号处理:医疗监护仪、测试仪器的信号耦合与滤波(对容值稳定性要求极高);
  4. 工业控制电路:PLC、伺服驱动器的信号传输与噪声抑制(抗干扰能力强)。

六、可靠性与品质保障

三环电子实施全流程品质管控,确保产品可靠性:

  • 认证资质:通过ISO9001、IATF16949汽车电子体系认证,部分批次符合国军标GJB要求;
  • 可靠性测试:经过高温存储、温度循环、湿度老化、机械振动等严苛测试,失效率≤10 FIT(典型值);
  • 批量一致性:自动化生产控制,同批次产品参数偏差极小,适合大规模量产应用。

该产品凭借稳定的电气性能、可靠的品质及广泛的适配性,成为中高压精密电路设计的优选方案。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.