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CCTC TCC1206COG470J202DT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- CCTC TCC1206COG470J202DT
- Type
- CCTC
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- CCTC
- Electronic Component
- TCC1206COG470J202DT
- Electronic Component
- 1
- Electronic Component
- 47pF
- Package
- 1206
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±5%
- Electronic Component
- 0.045g
- Electronic Component
- 1
- Electronic Component
- BM0265115680
- Electronic Component
- C0G
- Voltage
- 2kV
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TCC1206COG470J202DT 贴片多层陶瓷电容（MLCC）产品概述
一、产品基本定位
TCC1206COG470J202DT是三环电子（CCTC） 推出的高压精密贴片多层陶瓷电容（MLCC），专为需要稳定容值、耐受高压的电子电路设计。该产品采用1206标准贴片封装，搭载C0G（NP0）温度稳定型介质，兼具小体积、高可靠性与宽温域稳定特性，可满足工业、医疗、通信等领域的高压精密应用需求。
二、核心性能参数解析
- 容值与精度：标称容值47pF，精度标注为“J”（对应±5%），常规工作条件下容值偏差控制严格，适合对容值一致性要求高的电路；
- 额定电压：2kV（直流），“202”编码明确电压等级（20×10²=2000V），可稳定工作于高压直流电路中；
- 温度系数：C0G（原NP0），陶瓷电容中温度稳定性最优的介质之一，温度系数范围为±30ppm/℃，在-55℃至+125℃宽温域内，容值漂移极小（通常≤0.1%）；
- 封装规格：1206英制贴片封装，对应公制尺寸3.2mm×1.6mm×1.0mm（典型值），兼容常规自动化贴装设备，适配高密度PCB布局。
三、介质特性与应用价值
C0G介质是该产品的核心优势，直接决定了其应用场景的适配性：
- 容值无漂移：无直流偏置效应，即使在2kV高压下，容值也不会随电压变化，避免了X7R等介质的“电压降容”问题；
- 宽温域可靠：在极端温度（如-55℃低温或+125℃高温）下仍保持电性能稳定，适合户外、车载等宽温环境；
- 高频低损耗：损耗角正切（tanδ）极低（典型值≤0.001），适合射频电路、高速信号滤波等高频应用，减少信号衰减。
四、典型应用场景
结合产品参数，TCC1206COG470J202DT适用于以下高要求场景：
- 工业高压电源：变频器、PLC的EMI滤波电路，耐受2kV直流电压，抑制电磁干扰；
- 医疗设备：高压发生器、监护仪的精密信号滤波，依赖C0G的稳定容值保证信号准确性；
- 通信基站：射频模块的匹配网络、滤波电路，利用低损耗特性提升信号传输效率；
- 新能源领域：充电桩、光伏逆变器的高压控制电路，满足高电压、宽温域的可靠性要求；
- 航空航天电子：对容值稳定、抗恶劣环境要求高的精密电路，适配航空级应用标准。
五、品牌与可靠性保障
三环电子（CCTC）作为国内MLCC行业头部厂商，该产品具备以下可靠性优势：
- 环保合规：符合RoHS 2.0、REACH等国际环保标准，无铅无卤；
- 严苛测试：经过高温老化（125℃/1000h）、湿度循环（85℃/85%RH/1000h）、机械应力（振动、冲击）等测试，失效率低；
- 批量一致性：采用先进生产工艺，保证批量产品的容值、电压等参数一致性，降低电路设计风险。
该产品通过平衡高压耐受、容值稳定与小体积设计，成为工业级、医疗级等高压精密电路的优选元件。
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