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CCTC TCC0805COG101J101BT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- CCTC TCC0805COG101J101BT
- Type
- CCTC
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- CCTC
- Electronic Component
- TCC0805COG101J101BT
- Electronic Component
- 1
- Electronic Component
- 100pF
- Package
- 0805
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±5%
- Electronic Component
- 0.068g
- Electronic Component
- 1
- Electronic Component
- BM0265084176
- Electronic Component
- C0G
- Voltage
- 100V
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TCC0805COG101J101BT 多层陶瓷贴片电容（MLCC）产品概述
一、产品基本属性与品牌背景
TCC0805COG101J101BT是三环电子（CCTC） 推出的高性能多层陶瓷贴片电容（MLCC），属于C0G温度系数系列。三环电子作为国内MLCC领域主流厂商，专注陶瓷电容研发生产数十年，产品覆盖通信、工业控制、消费电子等领域，品质符合GB/T 2693-2001、IEC 60384-1等行业标准，可靠性经市场验证。
二、关键性能参数详解
该产品参数可通过型号直观对应，核心指标如下：
参数 数值/标识 说明 容值 100pF 型号“101”表示10×10¹=100pF（皮法） 精度 ±5% 字母“J”对应EIA精度等级（±5%） 额定直流电压 100V 型号后缀隐含100V额定值，适配中等电压场景 温度系数 C0G（NP0） 温度特性优异，-55℃~+125℃容值变化≤±30ppm/℃ 封装 0805（2012） 英制标注，对应公制尺寸2.0mm×1.2mm 工作温度范围 -55℃~+125℃ 宽温覆盖，满足工业级环境需求三、封装与结构特点
3.1 封装尺寸
0805为小型化贴片设计，典型尺寸：
- 长度：2.0±0.2mm
- 宽度：1.2±0.2mm
- 厚度：0.5±0.1mm
3.2 内部结构
采用多层陶瓷叠层技术：
- 介质层：C0G型陶瓷（低损耗、无极性），保证容值稳定；
- 内部电极：镍基合金，与介质层交替叠层形成储能结构；
- 端电极：三层复合结构（镍/铜/锡），提升焊接可靠性与耐蚀性。
四、适用应用场景
因C0G温度系数极低、容值稳定性优异，该产品适用于对精度要求较高的场景：
- 高频通信电路：5G基站、路由器、智能手机等射频（RF）模块的耦合、滤波、谐振；
- 精密模拟电路：运放反馈网络、ADC/DAC滤波、基准电压电路；
- 电源管理模块：100V额定电压支持工业电源、车载电源（非安全关键部位）的去耦、EMI滤波；
- 工业控制电路：PLC、变频器等设备的信号滤波、定时电路。
五、可靠性与环境适应性
- 焊接可靠性：端电极可承受回流焊温度（260℃±5℃）3次循环（每次10秒），符合IPC-A-610标准；
- 耐环境性能：通过湿热试验（40℃/93%RH，1000小时），容值变化≤±1%；
- 寿命特性：额定条件（100V、25℃）下，平均无故障时间（MTBF）≥1×10⁶小时；
- 机械性能：抗弯曲能力符合IPC-J-STD-020标准，可承受SMT生产中的搬运、焊接应力。
六、选型与应用注意事项
- 电压降额：实际工作电压建议≤80%额定值（80V），高温环境下需进一步降额至70%；
- 焊接工艺：回流焊需遵循三环推荐曲线（升温速率≤3℃/s，峰值260℃），避免陶瓷开裂；
- 静电防护：MLCC对静电敏感，生产/测试需佩戴静电手环，存储使用静电袋；
- 存储要求：未开封产品存于湿度≤60%环境，开封后1个月内使用完毕，避免端电极氧化。
总结
TCC0805COG101J101BT是高稳定、高可靠的C0G型MLCC，凭借宽温范围、精准容值和小型化封装，成为通信、工业、消费电子等领域的理想选择。其符合行业标准的性能与三环电子的品质保障，可满足不同场景下的设计需求。
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