Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TCC0603X7R272K500CT 是一款由 CCTC(三环)公司生产的贴片多层陶瓷电容(MLCC),广泛应用于各种电子设备中。该电容具有高可靠性、优异的电气性能和紧凑的尺寸,适用于高频滤波、去耦、旁路等应用场景。
TCC0603X7R272K500CT 的标称容值为 2.7nF,精度为 ±10%。这意味着在实际应用中,电容的容值可以在 2.43nF 到 2.97nF 之间波动。这种精度水平适用于大多数通用电子电路,尤其是在对容值要求不是特别严格的应用中。
该电容采用 X7R 材质,具有稳定的温度特性。X7R 材质的温度系数为 ±15%,在 -55°C 到 +125°C 的温度范围内,容值变化不超过 ±15%。这种特性使得 TCC0603X7R272K500CT 能够在较宽的温度范围内保持稳定的性能,适用于各种环境条件下的电子设备。
TCC0603X7R272K500CT 的额定电压为 50V,这意味着在正常工作条件下,电容可以承受的最大电压为 50V。在实际应用中,建议工作电压不超过额定电压的 80%,以确保电容的长期可靠性和稳定性。
该电容采用 0603 封装,尺寸为 1.6mm x 0.8mm,厚度为 0.8mm。0603 封装是一种常见的贴片电容封装形式,具有体积小、重量轻的特点,适用于高密度 PCB 布局。紧凑的尺寸使得 TCC0603X7R272K500CT 能够广泛应用于便携式电子设备、通信设备、计算机硬件等领域。
TCC0603X7R272K500CT 适用于多种电子电路,包括但不限于:
TCC0603X7R272K500CT 由 CCTC(三环)公司生产,该公司是中国领先的电子元器件制造商之一,以其高质量的产品和可靠的服务在业界享有盛誉。CCTC 公司严格遵循国际质量标准,确保每一颗电容都经过严格的测试和检验,以满足客户的需求。
TCC0603X7R272K500CT 是一款高性能的贴片多层陶瓷电容,具有稳定的容值、优异的温度特性和紧凑的尺寸。其广泛的应用领域和高可靠性使其成为电子设计工程师的理想选择。无论是用于消费电子、工业控制还是通信设备,TCC0603X7R272K500CT 都能提供卓越的性能和长期的稳定性。
通过以上详细的介绍,相信您对 TCC0603X7R272K500CT 有了更深入的了解。如果您有进一步的需求或疑问,欢迎随时联系我们的技术支持团队,我们将竭诚为您服务。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products