WMSIC Electronic Components

CCTC TCC1206X5R476K100HT

ModelTCC1206X5R476K100HT
Package1206
BrandCCTC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
CCTC TCC1206X5R476K100HT
Type
CCTC
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CCTC
Electronic Component
TCC1206X5R476K100HT
Electronic Component
1
Electronic Component
47uF
Package
1206
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.073g
Electronic Component
1
Electronic Component
BM0264873546
Electronic Component
X5R
Voltage
10V
Electronic Component
Electronic Component
Electronic Component
2000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TCC1206X5R476K100HT产品概述

一、产品简介

TCC1206X5R476K100HT为CCTC(三环)品牌的贴片多层陶瓷电容(MLCC),额定电容47µF,公差±10%(K),额定电压10V,介质型号X5R,封装1206(等效尺寸3216英制)。该系列面向体积受限场合,提供较高的电容密度与极低的等效串联电阻,适合去耦与储能应用。

二、主要参数

  • 容值:47µF ±10%
  • 额定电压:10V DC
  • 介质:X5R(温度范围和容值变化受X5R特性影响)
  • 封装:1206(约3.2mm×1.6mm)
  • 极性:无极性(双端)

三、产品特点与优势

  • 高容量:在1206尺寸下实现47µF,体积利用率高,适合空间受限的电源滤波方案。
  • 低ESR/低阻抗:适用于高频去耦与瞬态电流供给,改善电源稳定性。
  • 工艺兼容:支持回流焊工艺,符合常见的SMT装配流程。
  • 温度与频率响应:X5R介质在-55°C至+85°C范围内保持相对稳定,但存在温度系数与电压偏置效应需评估。

四、典型应用

  • 电源旁路与去耦(尤其在DC-DC转换器输入/输出端)
  • 消费电子、通信设备、笔记本和平板等便携式设备的能量储备与瞬态响应
  • 滤波、耦合以及一般电源稳定化场合

五、使用与封装注意事项

  • 电压偏置效应:高介电常数MLCC在接近额定电压时有效电容会下降,设计时建议评估工作电压下的实际电容余量。
  • 老化与温度特性:X5R存在随时间和温度变化的容值漂移,关键电路应考虑冗余或并联处理。
  • PCB布局:优先靠近IC电源引脚放置,缩短回流路径,多个电容并联可改善等效表现。
  • 焊接:建议按J-STD-020类回流曲线进行焊接,避免过高峰值温度与长时间热暴露。

六、可靠性与品质保障

CCTC供应链具有工业级生产管控,常见品质检验包括外观、容量/耐压测试及冷热循环等。对于要求更高的应用(如汽车或医疗),建议索取相关认证与可靠性报告以确认是否满足特定规范。

总体而言,TCC1206X5R476K100HT在有限空间内提供较高电容量和良好瞬态响应,适合大多数消费与工业类电源去耦及滤波应用。在设计时应特别注意X5R的电压与温度特性对有效电容的影响,并通过合理的电路布局与电容组合来保证系统性能。

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