Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TCC0603X7R301K500CT 是一款由 CCTC(三环)公司生产的贴片多层陶瓷电容(MLCC),具有高可靠性和优异的电气性能。该电容广泛应用于各种电子设备中,特别是在需要高稳定性和低损耗的电路中。其紧凑的尺寸和优异的性能使其成为现代电子设计中的理想选择。
3.1 容值与精度 TCC0603X7R301K500CT 的标称容值为 300pF,精度为 ±10%。这意味着在实际应用中,电容的实际容值可能在 270pF 到 330pF 之间。这种精度适用于大多数通用电子电路,特别是在不需要极高精度的场合。
3.2 材质与温度系数 该电容采用 X7R 材质,具有稳定的温度特性。X7R 材质的温度系数为 ±15% 在 -55°C 到 +125°C 的温度范围内。这种材质在宽温度范围内保持相对稳定的容值,适用于各种环境条件下的应用。
3.3 额定电压 TCC0603X7R301K500CT 的额定电压为 50V,这意味着它可以在不超过 50V 的电压下稳定工作。这种电压等级适用于大多数低电压电子设备,如消费电子产品、通信设备和工业控制系统。
3.4 封装尺寸 该电容采用 0603 封装,尺寸为 1.6mm x 0.8mm。这种紧凑的尺寸使其非常适合高密度电路板设计,特别是在空间受限的应用中。
TCC0603X7R301K500CT 广泛应用于以下领域:
CCTC(三环)是一家知名的电子元器件制造商,以其高质量和可靠性而闻名。TCC0603X7R301K500CT 经过严格的质量控制和测试,确保其在各种应用中的稳定性和耐久性。
TCC0603X7R301K500CT 是一款高性能的贴片多层陶瓷电容,具有稳定的容值、宽温度范围和紧凑的尺寸。其优异的电气性能和可靠性使其成为各种电子设备中的理想选择。无论是消费电子产品、通信设备还是工业控制系统,TCC0603X7R301K500CT 都能提供卓越的性能和可靠性。
通过选择 TCC0603X7R301K500CT,您可以确保您的电子设计在性能和可靠性方面达到最高标准。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products