WMSIC Electronic Components

CCTC TCC1206X7R103K500DT

ModelTCC1206X7R103K500DT
Package1206
BrandCCTC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
CCTC TCC1206X7R103K500DT
Type
CCTC
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CCTC
Electronic Component
TCC1206X7R103K500DT
Electronic Component
1
Electronic Component
10nF
Package
1206
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.045g
Electronic Component
1
Electronic Component
BM0264907451
Electronic Component
X7R
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TCC1206X7R103K500DT 产品概述

1. 产品简介

TCC1206X7R103K500DT 是一款由 CCTC(三环)公司生产的贴片多层陶瓷电容(MLCC),具有高可靠性、优异的电气性能和广泛的应用范围。该电容采用 X7R 材质,容值为 10nF,额定电压为 50V,精度为 ±10%,封装尺寸为 1206(即 3.2mm x 1.6mm)。该产品适用于各种电子设备中的滤波、耦合、去耦等电路应用。

2. 主要特性

  • 容值: 10nF
  • 材质: X7R
  • 精度: ±10%
  • 额定电压: 50V
  • 封装: 1206(3.2mm x 1.6mm)
  • 温度系数: X7R(-55°C 至 +125°C,容值变化 ±15%)
  • 品牌: CCTC(三环)

3. 应用领域

TCC1206X7R103K500DT 广泛应用于各种电子设备中,包括但不限于:

  • 消费电子: 如智能手机、平板电脑、笔记本电脑等。
  • 通信设备: 如路由器、交换机、基站等。
  • 工业控制: 如PLC、传感器、电机控制等。
  • 汽车电子: 如车载娱乐系统、导航系统、车身控制模块等。
  • 医疗设备: 如监护仪、诊断设备、治疗设备等。

4. 技术参数

  • 容值: 10nF
  • 材质: X7R
  • 精度: ±10%
  • 额定电压: 50V
  • 封装: 1206(3.2mm x 1.6mm)
  • 温度系数: X7R(-55°C 至 +125°C,容值变化 ±15%)
  • 工作温度范围: -55°C 至 +125°C
  • 介质损耗: ≤2.5%
  • 绝缘电阻: ≥10GΩ

5. 产品优势

  • 高可靠性: 采用优质材料和先进工艺,确保产品在各种恶劣环境下稳定工作。
  • 优异的电气性能: 低 ESR(等效串联电阻)和低 ESL(等效串联电感),提供优异的滤波和去耦效果。
  • 广泛的应用范围: 适用于多种电子设备,满足不同应用场景的需求。
  • 环保合规: 符合 RoHS 和 REACH 等环保法规,绿色环保。

6. 使用注意事项

  • 焊接温度: 建议使用回流焊,峰值温度不超过 260°C,时间不超过 10 秒。
  • 存储条件: 应存放在干燥、无尘、无腐蚀性气体的环境中,避免高温和高湿。
  • 机械应力: 避免在安装和使用过程中施加过大的机械应力,以防止电容损坏。

7. 包装与运输

  • 包装形式: 卷带包装,每卷 4000 片。
  • 运输方式: 采用防静电包装,确保产品在运输过程中不受静电损害。

8. 质量保证

CCTC(三环)公司对 TCC1206X7R103K500DT 提供严格的质量控制和全面的质量保证,确保每一片电容都符合国际标准和客户要求。

9. 结论

TCC1206X7R103K500DT 是一款高性能、高可靠性的贴片多层陶瓷电容,适用于各种电子设备中的滤波、耦合、去耦等电路应用。其优异的电气性能、广泛的应用范围和环保合规性,使其成为电子工程师的理想选择。无论是消费电子、通信设备、工业控制、汽车电子还是医疗设备,TCC1206X7R103K500DT 都能提供稳定可靠的电容解决方案。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.