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Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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TCC0603X7R331K500CT 是一款由 CCTC(三环)公司生产的贴片多层陶瓷电容器(MLCC),具有高可靠性、优异的电气性能和紧凑的封装尺寸。该电容器广泛应用于各种电子设备中,特别是在需要高稳定性和小尺寸的场合。
TCC0603X7R331K500CT 的标称容值为 330pF,精度为 ±10%。这意味着在实际应用中,电容值可以在 297pF 到 363pF 之间波动。这种精度适用于大多数通用电子电路,特别是在对电容值要求不严格的场合。
该电容器采用 X7R 材质,具有较宽的工作温度范围(-55°C 到 +125°C)和良好的温度稳定性。X7R 材质的温度系数为 ±15%,在规定的温度范围内,电容值的变化不会超过 ±15%。这使得 TCC0603X7R331K500CT 适用于各种环境条件下的应用。
TCC0603X7R331K500CT 的额定电压为 50V,这意味着它可以在不超过 50V 的电压下稳定工作。这种电压等级适用于大多数低电压电子设备,如消费电子产品、通信设备和工业控制系统。
该电容器采用 0603 封装,尺寸为 1.6mm x 0.8mm。这种紧凑的封装尺寸使得 TCC0603X7R331K500CT 非常适合高密度 PCB 设计,特别是在空间受限的应用中。
TCC0603X7R331K500CT 广泛应用于各种电子设备中,包括但不限于:
TCC0603X7R331K500CT 由 CCTC(三环)公司生产,该公司在电子元器件领域具有多年的生产经验和技术积累。CCTC 的产品以高可靠性和优异的性能著称,广泛应用于全球各地的电子设备中。
TCC0603X7R331K500CT 是一款高性能的贴片多层陶瓷电容器,具有 330pF 的容值、±10% 的精度、50V 的额定电压和 0603 的封装尺寸。其 X7R 材质提供了良好的温度稳定性,适用于各种环境条件下的应用。该电容器由 CCTC(三环)公司生产,具有高可靠性和优异的电气性能,广泛应用于消费电子、通信设备、工业控制系统和汽车电子等领域。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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