WMSIC Electronic Components

CCTC TCC0603COG6R2C500CT

ModelTCC0603COG6R2C500CT
Package0603
BrandCCTC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

17 specifications

Core information

Product name
CCTC TCC0603COG6R2C500CT
Type
CCTC
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CCTC
Electronic Component
TCC0603COG6R2C500CT
Electronic Component
1
Electronic Component
6.2pF
Package
0603
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
0.035g
Electronic Component
1
Electronic Component
BM0265115705
Electronic Component
C0G
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TCC0603COG6R2C500CT 产品概述

一、产品简介

TCC0603COG6R2C500CT 为 CCTC(三环)出品的一款贴片多层陶瓷电容(MLCC),封装尺寸 0603(约 1.6 mm × 0.8 mm),标称容量 6.2 pF,额定电压 50 V,温度系数 C0G(又称 NP0)。该型号定位于对温度稳定性和频率特性要求较高的精密与高频电路应用。

二、主要电气特性

  • 容值:6.2 pF(标称)
  • 额定电压:50 V DC
  • 温度系数:C0G(近零温漂,典型 ±30 ppm/°C 级别)
  • 介质类型:高级 NP0/C0G 陶瓷,损耗低、介电损耗角正切(tanδ)小
  • 高频特性:自谐振频率高,寄生电感与等效串联电阻(ESR/ESL)较小,适合射频和脉冲环境

三、产品特点与优势

  • 温度与电压稳定性优异:C0G 介质提供极小的容量漂移,适合精密滤波、定时和基准电路。
  • 低损耗、高 Q 值:在射频前端及高频滤波器中表现良好。
  • 小型封装:0603 有利于高密度 PCB 布局与自动化贴装。
  • 抗直流偏置能力强:与其他高 k 值介质相比,容量随偏置电压变化微小。

四、典型应用场景

  • 高频滤波、谐振电路与阻抗匹配(RF 前端)
  • 振荡器与定时电路(石英/振荡器负载)
  • 精密模拟电路的耦合/旁路与采样电容
  • 测量仪器、通信设备、汽车电子(视认证)与消费类电子的关键节点

五、封装与装配建议

  • 封装:0603(表面贴装),常见供货形式为卷带包装,便于 SMT 贴片机使用。
  • 焊接:推荐按无铅回流焊曲线进行回流,避免超温与过长保温时间。
  • 工艺注意:避免基板弯曲或机械应力集中,贴片电容对弯曲与冲击较敏感;回流前后均应采取防静电与防潮措施。

六、可靠性与存储

  • 存储建议放置于干燥、常温环境,拆卷后若超过规定时间建议回烘或按厂商说明处理。
  • 常规 MLCC 对机械冲击与过度弯曲敏感,装配、测试与清洗工艺需避免对器件施加过大应力。
  • 关于 RoHS、AEC-Q 等认证或额外可靠性测试,请在采购时向供应商索取具体资料与报表以确认。

如需产品的详细电气等效电路参数、回流焊曲线、储运包装规格或样片测试报告,可提供采购数量与用途,我可协助整理并给出更具体的选型与验证建议。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.