WMSIC Electronic Components

CCTC TCC0603X7R223K101CT

ModelTCC0603X7R223K101CT
Package0603
BrandCCTC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
CCTC TCC0603X7R223K101CT
Type
CCTC
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CCTC
Electronic Component
TCC0603X7R223K101CT
Electronic Component
1
Electronic Component
22nF
Package
0603
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.035g
Electronic Component
1
Electronic Component
BM0264907433
Electronic Component
X7R
Voltage
100V
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TCC0603X7R223K101CT 产品概述

1. 产品简介

TCC0603X7R223K101CT 是一款由CCTC(三环)公司生产的贴片多层陶瓷电容器(MLCC),具有22nF的容值,采用X7R材质,额定电压为100V,精度为±10%,封装形式为0603。该电容器广泛应用于各种电子设备中,提供稳定的电容性能,适用于高频滤波、去耦、旁路等应用场景。

2. 技术参数

  • 商品分类: 贴片电容(MLCC)
  • 容值: 22nF
  • 材质(温度系数): X7R
  • 精度: ±10%
  • 额定电压: 100V
  • 封装: 0603
  • 品牌: CCTC(三环)

3. 材质与温度特性

X7R材质是一种常见的陶瓷电容材料,具有较宽的工作温度范围(-55°C至+125°C)和稳定的电容温度特性。X7R材质的电容在温度变化时,其容值变化较小,适用于需要较高温度稳定性的应用场合。

4. 封装与尺寸

0603封装是一种常见的贴片电容封装形式,其尺寸为1.6mm x 0.8mm。这种封装形式适用于高密度PCB布局,能够有效节省电路板空间,同时提供良好的电气性能和机械强度。

5. 应用领域

TCC0603X7R223K101CT 适用于多种电子设备中,包括但不限于:

  • 消费电子产品: 如智能手机、平板电脑、笔记本电脑等,用于电源滤波、信号耦合等。
  • 工业控制设备: 如PLC、变频器、伺服驱动器等,用于去耦、旁路等。
  • 通信设备: 如基站、路由器、交换机等,用于高频滤波、信号处理等。
  • 汽车电子: 如车载娱乐系统、导航系统、发动机控制单元等,用于电源管理、信号处理等。

6. 性能优势

  • 高可靠性: 采用优质陶瓷材料和先进制造工艺,确保产品在恶劣环境下仍能稳定工作。
  • 宽温度范围: X7R材质提供宽温度范围内的稳定电容性能,适用于各种环境条件。
  • 高精度: ±10%的精度满足大多数应用需求,确保电路设计的准确性。
  • 小尺寸: 0603封装形式适用于高密度PCB布局,节省电路板空间。

7. 使用注意事项

  • 焊接条件: 建议使用回流焊或波峰焊工艺,焊接温度和时间应符合相关标准,避免过热导致电容损坏。
  • 存储条件: 产品应存放在干燥、无尘的环境中,避免高温、高湿和强磁场的影响。
  • 电气参数: 在实际应用中,应确保工作电压不超过额定电压,避免过压导致电容击穿。

8. 品牌介绍

CCTC(三环)是中国领先的电子元器件制造商,专注于陶瓷电容器的研发、生产和销售。公司拥有先进的生产设备和技术,产品广泛应用于消费电子、工业控制、通信设备、汽车电子等领域,以高质量和可靠性赢得了客户的信赖。

9. 总结

TCC0603X7R223K101CT 是一款性能优异、应用广泛的贴片多层陶瓷电容器,具有22nF的容值、100V的额定电压和±10%的精度,采用X7R材质和0603封装形式。该电容器适用于多种电子设备中,提供稳定的电容性能和高可靠性,是电路设计中不可或缺的元件之一。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.