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CCTC TCC0603COG430J500CT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- CCTC TCC0603COG430J500CT
- Type
- CCTC
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- CCTC
- Electronic Component
- TCC0603COG430J500CT
- Electronic Component
- 1
- Electronic Component
- 43pF
- Package
- 0603
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±5%
- Electronic Component
- 0.035g
- Electronic Component
- 1
- Electronic Component
- BM0265084178
- Electronic Component
- C0G
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TCC0603COG430J500CT 产品概述
一、产品简介
TCC0603COG430J500CT 为三环（CCTC）品牌一款贴片多层陶瓷电容（MLCC），公称电容量 43pF，容差 ±5%，额定电压 50V，介质为 C0G（又称 NP0）。封装为 0603（典型外形约 0.06"×0.03"，约 1.6×0.8 mm），适配自动化表面贴装工艺，常用于对温度稳定性和频率性能要求高的射频及精密模拟电路。
二、主要参数
- 电容量：43 pF
- 精度：±5%（J）
- 额定电压：50 V DC
- 温度特性：C0G（接近 0 ppm/°C 的温度系数，典型为 0±30 ppm/°C 级别）
- 封装：0603（表面贴装）
- 工作温度范围：常见范围 -55°C 至 +125°C（以厂家规格为准）
三、产品特点与优势
- 优异的温度稳定性：C0G/NP0 介质在宽温区间内电容变化极小，适合精密滤波与时间常数稳定场合。
- 低损耗、高 Q 值：适合高频应用，如射频链路、谐振与匹配网络。
- 小型化封装：0603 适合高密度 PCB 布局，并兼容常规自动贴片与回流焊工艺。
- 良好的长期可靠性：多层陶瓷结构在机械与电气上具有稳定特性，适合量产使用。
四、典型应用场景
- 射频前端匹配网络、谐振电路与带通/带阻滤波器
- 晶振/振荡器的负载与补偿电容
- 精密模拟电路、采样/ADC 前端的参考与耦合电容
- 高频去耦、阻抗整形与相位控制场合（非大值旁路）
五、封装与工艺建议
- 贴装：兼容无铅回流焊，建议依据制造商提供的回流曲线与 IPC/JEDEC 标准执行。
- 储存与防潮：贴片电容应按厂家推荐的防潮包装（干燥盒或卷带封装）存放，必要时回流前进行烘烤除湿。
- 焊接注意：避免在焊接与后处理过程中对器件施加过大机械应力或 PCB 弯曲，以防端接裂纹或失效。
六、采购与型号说明
型号 TCC0603COG430J500CT 可理解为品牌—封装—介质—电容量编码—容差—额定电压—包装等信息的组合（具体编码规则以厂家说明书为准）。产品通常以卷带（Tape & Reel）形式提供，便于 SMT 大批量贴装。订购时请核实完整规格书、批次与合格证。
七、可靠性与测试
C0G MLCC 在温漂、介质损耗与介电击穿等方面表现稳定。设计时应关注工作电压下的电容电压依赖（VCC）特性、热循环与机械冲击等可靠性验证，必要时参考厂家的可靠性测试数据与认证（如 RoHS 等）。
TCC0603COG430J500CT 针对需要高稳定性与低损耗的小电容应用提供了尺寸与性能平衡的解决方案。若需完整电气参数、机械尺寸图或回流工艺建议，请联系三环（CCTC）或其授权分销商索取官方规格书与可靠性报告。
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