Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
CCTC TCC1206COG220J102DT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- CCTC TCC1206COG220J102DT
- Type
- CCTC
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- CCTC
- Electronic Component
- TCC1206COG220J102DT
- Electronic Component
- 1
- Electronic Component
- 22pF
- Package
- 1206
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±5%
- Electronic Component
- 0.045g
- Electronic Component
- 1
- Electronic Component
- BM0265115657
- Electronic Component
- C0G
- Voltage
- 1kV
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TCC1206COG220J102DT 产品概述
1. 产品简介
TCC1206COG220J102DT 是一款由 CCTC（三环）公司生产的高性能贴片多层陶瓷电容（MLCC）。该电容具有 22pF 的容值，采用 C0G 材质，具备优异的温度稳定性和高频特性。其额定电压为 1kV，精度为 ±5%，封装形式为 1206，适用于各种高可靠性电子设备中。
2. 关键特性
- 容值: 22pF
- 材质: C0G（温度系数为 0 ±30ppm/°C）
- 精度: ±5%
- 额定电压: 1kV
- 封装: 1206（3.2mm x 1.6mm）
3. 应用领域
TCC1206COG220J102DT 广泛应用于以下领域：
- 通信设备: 用于高频滤波、耦合和去耦电路，确保信号传输的稳定性和可靠性。
- 医疗电子: 在医疗设备中用于高精度电路，提供稳定的电容性能。
- 工业控制: 用于工业自动化设备中的高可靠性电路，确保设备长期稳定运行。
- 汽车电子: 在汽车电子系统中用于高电压和高温度环境下的电路，提供可靠的电容支持。
4. 技术优势
- 高温度稳定性: 采用 C0G 材质，温度系数为 0 ±30ppm/°C，确保在宽温度范围内电容值的稳定性。
- 高额定电压: 额定电压为 1kV，适用于高电压应用场景。
- 高精度: 容值精度为 ±5%，满足高精度电路的需求。
- 小型化封装: 1206 封装形式，适合高密度电路板设计。
5. 产品规格
- 尺寸: 3.2mm x 1.6mm
- 容值: 22pF
- 温度系数: C0G（0 ±30ppm/°C）
- 精度: ±5%
- 额定电压: 1kV
- 工作温度范围: -55°C 至 +125°C
6. 使用注意事项
- 焊接条件: 建议使用回流焊工艺，焊接温度曲线应符合 IPC/JEDEC J-STD-020 标准。
- 存储条件: 应存储在干燥、无尘的环境中，避免高温和高湿度。
- 电气特性: 在使用前应进行电气特性测试，确保电容性能符合设计要求。
7. 质量与可靠性
TCC1206COG220J102DT 经过严格的质量控制和可靠性测试，确保产品在恶劣环境下的长期稳定性和可靠性。CCTC 公司拥有完善的质量管理体系，产品符合 RoHS 和 REACH 等环保标准。
8. 结论
TCC1206COG220J102DT 是一款高性能、高可靠性的贴片多层陶瓷电容，适用于各种高要求的电子设备中。其优异的温度稳定性、高额定电压和高精度特性，使其成为通信、医疗、工业和汽车电子等领域的理想选择。CCTC 公司凭借其先进的生产技术和严格的质量控制，确保该产品在市场上具有卓越的竞争力。
通过以上概述，用户可以全面了解 TCC1206COG220J102DT 的性能特点和应用场景，为设计高可靠性电子设备提供有力支持。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
