WMSIC Electronic Components

CCTC TCC0603COG200F500CT

ModelTCC0603COG200F500CT
Package0603
BrandCCTC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
CCTC TCC0603COG200F500CT
Type
CCTC
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CCTC
Electronic Component
TCC0603COG200F500CT
Electronic Component
1
Electronic Component
20pF
Package
0603
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±1%
Electronic Component
0.035g
Electronic Component
1
Electronic Component
BM0265084170
Electronic Component
C0G
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TCC0603COG200F500CT 产品概述

一、产品简介

TCC0603COG200F500CT 为 CCTC(三环)品牌的一款高稳定性贴片多层陶瓷电容(MLCC)。额定容量为 20 pF,容差 ±1%(F),额定电压 50 V,温度系数 C0G(亦称 NP0),封装 0603(1608 公制)。该器件以极低的温度系数和极小的损耗著称,适用于对频率稳定性、时序和高 Q 值有较高要求的电路。

二、主要特性

  • 容值:20 pF,容差 ±1%(高精度等级)
  • 额定电压:50 V,适配中低压信号与电源旁路需求
  • 温度系数:C0G(近似零温度漂移,温度稳定性优异)
  • 封装:0603(适合高密度 SMT 装配)
  • 介质损耗低,等效串联阻抗(ESR/ESL)低,适合射频、振荡及滤波电路
  • 符合无铅 / RoHS 要求,适配自动贴片生产线

三、典型电气与环境规格

  • 工作温度范围:常见 -55 ℃ 至 +125 ℃(依具体规格表为准)
  • 温度稳定性:C0G 型号在温度变化下电容值几乎恒定,适合高精度计时与滤波应用
  • 介质特性:线性、高 Q、低介质损耗,射频与高速信号路径影响小
    (注:具体额定寿命、耐压及绝缘阻抗等参数,请以厂家数据手册为准)

四、应用场景

  • 高频/射频回路的耦合、旁路与匹配
  • 振荡器、时钟电路、滤波器及高稳定性定容网络
  • 精密模拟电路与传感器前端的去耦与稳定元件
  • 手机、通信设备、GPS、仪器仪表及消费电子等高密度 PCB 设计

五、封装与焊接建议

  • 推荐遵循 IPC-7351 板面设计规则选择 0603 焊盘与治具尺寸,减少应力集中以防开裂
  • 回流焊工艺建议参照 J-STD-020(最高回流温度一般不超过 260 ℃),避免超温或长时间高温暴露
  • 贴装时避免基板弯曲与机械应力,焊膏量与焊盘扩展要均衡以减少应力集中
  • 清洗与后处理应避免使用会引起腐蚀或残留应力的工艺

六、可靠性与包装

  • 常见可靠性试验包括温度循环、湿热、焊接热冲击与机械冲击测试,以验证长期稳定性与焊接兼容性
  • 常用卷带(Tape & Reel)包装,适配自动贴片机;包装规格与数量可按订单要求提供
  • 型号说明示例:TCC 0603 COG 200 F 500 CT —— 代表 0603 封装、C0G 介质、20 pF、±1%、50 V、卷带包装

本产品适合对电容稳定性与精度有严格要求的电子设计,可显著提升滤波、定时与射频电路的性能与可靠性。如需完整电气特性曲线及尺寸图纸,请联系供应商索取数据手册。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.