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Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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TCC0805X7R562K500DT 是一款由 CCTC(三环)公司生产的贴片多层陶瓷电容器(MLCC),广泛应用于各种电子设备中。该电容器具有稳定的电气性能和高可靠性,适用于高频滤波、去耦、旁路等电路应用。
TCC0805X7R562K500DT 的标称容值为 5.6nF,精度为 ±10%。这意味着在实际应用中,电容值可能在 5.04nF 到 6.16nF 之间波动。这种精度适用于大多数通用电路设计,尤其是在对电容值要求不特别严格的场合。
该电容器采用 X7R 材质,具有较宽的温度稳定性范围。X7R 材质的温度系数为 ±15%,在 -55°C 到 +125°C 的温度范围内,电容值的变化不会超过 ±15%。这使得 TCC0805X7R562K500DT 适用于各种环境温度下的电子设备。
TCC0805X7R562K500DT 的额定电压为 50V,这意味着在正常工作条件下,电容器可以承受的最大电压为 50V。超过此电压可能会导致电容器损坏或性能下降。因此,在设计电路时,应确保工作电压不超过此额定值。
该电容器采用 0805 封装,尺寸为 2.0mm x 1.25mm。这种封装尺寸适用于高密度电路板设计,能够有效节省空间,同时便于自动化贴片生产。
TCC0805X7R562K500DT 广泛应用于各种电子设备中,包括但不限于:
TCC0805X7R562K500DT 由 CCTC(三环)公司生产,该公司是中国领先的电子元器件制造商之一,以其高质量和可靠性著称。CCTC 的产品经过严格的质量控制和测试,确保在各种应用场景下都能提供稳定的性能。
TCC0805X7R562K500DT 是一款高性能的贴片多层陶瓷电容器,具有稳定的电气性能和高可靠性。其 5.6nF 的容值、±10% 的精度、50V 的额定电压以及 0805 的封装尺寸,使其成为各种电子设备中的理想选择。无论是消费电子、通信设备、工业控制还是汽车电子,TCC0805X7R562K500DT 都能提供卓越的性能和可靠性。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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