WMSIC Electronic Components

CCTC TCC0805X7R473K251DT

ModelTCC0805X7R473K251DT
Package0805
BrandCCTC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
CCTC TCC0805X7R473K251DT
Type
CCTC
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CCTC
Electronic Component
TCC0805X7R473K251DT
Electronic Component
1
Electronic Component
47nF
Package
0805
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.068g
Electronic Component
1
Electronic Component
BM0265115509
Electronic Component
X7R
Voltage
250V
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TCC0805X7R473K251DT 产品概述

一、产品简介

TCC0805X7R473K251DT 为 CCTC(三环)出品的贴片多层陶瓷电容(MLCC),标称容量 47nF(473)、初始精度 ±10%(K),介质为 X7R,额定电压 250V,封装规格 0805(公制 2012,约 2.0 × 1.25 mm)。该系列面向对体积、频率响应和稳态电气特性有综合要求的通用电子应用。

二、主要性能特点

  • 容值:47nF,适合中小容量旁路、耦合与滤波用途。
  • 容差:±10%,便于在非高精度电路中降低成本和备货复杂度。
  • 介质:X7R(-55°C 至 +125°C),具有较好的温度稳定性与体积效率(属于 II 类陶瓷)。
  • 额定电压:250V,适合较高电压工作场合,但应注意直流偏压下的电容偏移与衰减。
  • 封装:0805,适配常见贴片工艺与自动化贴装设备,机械强度与装配效率平衡良好。
  • 典型电气特性:低等效串联电阻(ESR)和良好高频响应,适合去耦和高频滤波。

三、应用建议

适用于开关电源旁路、输入滤波、耦合/去耦、EMI 抑制、高频旁路等场景。不建议用作替代安全 X/Y 电容于直接连接市电的跨线或对地安全关键位置;若用于高压直流或高压脉冲场合,请参考厂方偏压特性曲线并预留裕量。

四、设计与可靠性注意事项

  • 偏压与温度影响:X7R 在较高直流偏压或温度下会出现容量降低,设计时应查阅厂方 DC-bias 曲线并进行裕量设计。
  • 焊接与工艺:支持常规回流焊,遵循厂方最高回流温度(一般峰值 ≤260°C)和曲线。避免在装配过程中对器件引脚施加过大机械应力以免出现裂纹。
  • 环境与寿命:X7R 为介电常数较高的陶瓷,长期在高温或高电场工况下可能有电学参数漂移,需在可靠性评估中考虑温度循环、湿热与机械冲击测试。

五、封装与订购信息

型号:TCC0805X7R473K251DT;封装:0805(2012);品牌:CCTC(三环)。产品一般以卷带(Tape & Reel)供货,便于 SMT 贴片生产线直接使用。订购时请确认包装单位、储存条件以及是否需出具供应商偏压/温漂曲线与可靠性报告。

如需更详细的电气特性曲线(频率响应、ESR、DC-bias 曲线)、回流焊工艺参数或样品测试数据,可提供具体应用场景与测试条件,我可协助查找或给出针对性的设计建议。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.