WMSIC Electronic Components

CCTC TCC1206X7R471K500DT

ModelTCC1206X7R471K500DT
Package1206
BrandCCTC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
CCTC TCC1206X7R471K500DT
Type
CCTC
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CCTC
Electronic Component
TCC1206X7R471K500DT
Electronic Component
1
Electronic Component
470pF
Package
1206
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.045g
Electronic Component
1
Electronic Component
BM0265115662
Electronic Component
X7R
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TCC1206X7R471K500DT 产品概述

1. 产品简介

TCC1206X7R471K500DT 是一款由 CCTC(三环)公司生产的贴片多层陶瓷电容器(MLCC),具有高可靠性、优异的电气性能和广泛的应用范围。该电容器采用 X7R 介质材料,具有稳定的温度特性和良好的电容值保持能力,适用于各种电子设备中的滤波、耦合、旁路等电路。

2. 主要参数

  • 商品分类: 贴片电容(MLCC)
  • 容值: 470pF
  • 材质(温度系数): X7R
  • 精度: ±10%
  • 额定电压: 50V
  • 封装: 1206

3. 产品特点

  • 高可靠性: 采用优质材料和先进制造工艺,确保产品在恶劣环境下仍能稳定工作。
  • 优异的电气性能: 低等效串联电阻(ESR)和低等效串联电感(ESL),提供高效的滤波和去耦效果。
  • 稳定的温度特性: X7R 介质材料在 -55°C 至 +125°C 的温度范围内,电容值变化率不超过 ±15%。
  • 广泛的应用范围: 适用于消费电子、通信设备、工业控制、汽车电子等领域。

4. 技术规格

  • 电容值: 470pF
  • 精度: ±10%
  • 额定电压: 50V
  • 温度系数: X7R(-55°C 至 +125°C,电容值变化率 ±15%)
  • 封装尺寸: 1206(3.2mm x 1.6mm)
  • 工作温度范围: -55°C 至 +125°C
  • 储存温度范围: -55°C 至 +125°C

5. 应用领域

  • 消费电子: 智能手机、平板电脑、笔记本电脑等设备中的滤波、耦合、旁路电路。
  • 通信设备: 基站、路由器、交换机等设备中的信号处理和电源管理电路。
  • 工业控制: PLC、变频器、伺服驱动器等设备中的滤波和去耦电路。
  • 汽车电子: 车载娱乐系统、导航系统、发动机控制单元等设备中的滤波和耦合电路。

6. 使用注意事项

  • 焊接条件: 建议使用回流焊或波峰焊工艺,焊接温度曲线应符合 IPC/JEDEC J-STD-020 标准。
  • 存储条件: 产品应存放在干燥、无尘、无腐蚀性气体的环境中,避免阳光直射和高温高湿。
  • 使用环境: 避免在超出额定电压和温度范围的环境中使用,以免影响产品性能和寿命。

7. 质量保证

CCTC(三环)公司严格执行 ISO9001 质量管理体系,确保每一颗 TCC1206X7R471K500DT 电容器都经过严格的测试和检验,符合国际标准和客户要求。

8. 包装与交付

  • 包装方式: 卷带包装,每卷 4000 颗。
  • 交付周期: 常规产品交付周期为 2-4 周,可根据客户需求提供加急服务。

9. 环保与合规

TCC1206X7R471K500DT 符合 RoHS、REACH 等环保法规要求,不含铅、汞、镉等有害物质,符合绿色环保理念。

10. 技术支持

CCTC(三环)公司提供全面的技术支持,包括产品选型、应用指导、故障分析等,确保客户能够充分发挥产品的性能优势。

总结

TCC1206X7R471K500DT 是一款高性能、高可靠性的贴片多层陶瓷电容器,适用于各种电子设备中的滤波、耦合、旁路等电路。其优异的电气性能、稳定的温度特性和广泛的应用范围,使其成为电子工程师的理想选择。CCTC(三环)公司以其严格的质量管理和全面的技术支持,确保客户能够获得最优质的产品和服务。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.