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CCTC TCC0603X5R106M100CT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- CCTC TCC0603X5R106M100CT
- Type
- CCTC
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- CCTC
- Electronic Component
- TCC0603X5R106M100CT
- Electronic Component
- 1
- Electronic Component
- 10uF
- Package
- 0603
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±20%
- Electronic Component
- 0.035g
- Electronic Component
- 1
- Electronic Component
- BM0264935664
- Electronic Component
- X5R
- Voltage
- 10V
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TCC0603X5R106M100CT 贴片陶瓷电容（MLCC）产品概述
一、产品基本信息
TCC0603X5R106M100CT是三环电子（CCTC） 推出的多层片式陶瓷电容（MLCC），型号命名遵循行业通用规则：
- TCC：三环电子品牌代码；
- 0603：英制封装尺寸（对应公制1608，实际尺寸为1.6mm×0.8mm×0.8mm，典型厚度）；
- X5R：温度系数特性（-55℃~+85℃范围内，容值变化±15%）；
- 106：容值代码（10×10⁶ pF = 10μF）；
- M：容值精度（±20%）；
- 100：额定直流电压（10V）；
- CT：三环内部工艺/批次标识。
二、核心电气性能参数
该产品关键参数明确，适配低电压、中等容值的小型化场景：
参数项 规格值 标称容值 10μF（106） 容值精度 ±20%（M档） 额定直流电压 10V（DC） 温度系数/特性 X5R（-55℃~+85℃，ΔC/C±15%） 封装尺寸 0603（英制，1.6×0.8mm） 介质类型 多层陶瓷介质 电极类型 镍基贱金属电极（BMEC）三、工艺与结构优势
三环电子作为国内老牌MLCC制造商，该产品工艺具备以下特点：
- 介质稳定性：采用优化X5R陶瓷配方，降低温度对容值的影响，避免普通NP0介质的线性温漂；
- 低寄生参数：镍电极与介质匹配性良好，ESR（等效串联电阻）≤10mΩ（1kHz下），ESL（等效串联电感）≤0.5nH，适合高频滤波；
- 环保可靠性：无铅无卤封装，符合RoHS 2.0及REACH标准；封装密封性强，耐湿性能满足IEC 60068-2-67湿负荷测试；
- 小型化适配：0603封装体积小巧，可节省PCB布局空间，适配高密度集成终端。
四、典型应用场景
基于10V电压、10μF容值及X5R温度特性，该产品广泛应用于：
- 消费电子：智能手机、平板电脑的小信号电源滤波、音频耦合电路；
- 通信设备：WiFi模块、小型基站的射频滤波、信号耦合支路；
- 工业控制：低功耗MCU、传感器模块的电源去耦、信号滤波；
- 物联网终端：智能穿戴（手表/手环）、智能家居节点的电源稳压滤波。
五、可靠性与环境适应性
该产品在额定条件下具备稳定可靠性：
- 工作温度：-55℃~+85℃（符合X5R特性）；
- 存储温度：-40℃~+85℃（无负载存储）；
- 寿命特性：额定电压/温度下，平均无故障时间（MTBF）≥10⁶小时；
- 机械性能：耐振动（10~2000Hz，2g加速度）、耐冲击（1000m/s²），满足电子设备环境应力要求。
六、选型与使用注意事项
- 电压降额：建议实际工作电压不超过8V（额定值80%），延长寿命；
- 温度限制：避免工作温度超85℃，否则容值变化可能超出±15%；
- 焊接工艺：回流焊峰值温度240℃±5℃，时间≤10秒（符合J-STD-020），避免机械应力导致陶瓷开裂；
- 替代参考：同规格可优先选择三环同系列产品，跨品牌替代需确认参数一致性及可靠性。
该产品凭借稳定的电气性能、小型化设计及可靠工艺，成为消费电子、通信等领域的高性价比选型。
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