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CCTC TCC0201X7R103K250ZT
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- CCTC TCC0201X7R103K250ZT
- Type
- CCTC
- Minimum package
- 15000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- CCTC
- Electronic Component
- TCC0201X7R103K250ZT
- Electronic Component
- 1
- Electronic Component
- 10nF
- Package
- 0201
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.008g
- Electronic Component
- 50
- Electronic Component
- BM0264582153
- Electronic Component
- X7R
- Voltage
- 25V
- Electronic Component
- Electronic Component
- Electronic Component
- 15000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TCC0201X7R103K250ZT 贴片陶瓷电容产品概述
一、产品基本定位与核心属性
TCC0201X7R103K250ZT是三环电子（CCTC） 推出的一款超小型多层陶瓷贴片电容（MLCC），专为高密度、小型化电子设备设计。产品采用0201英制封装（对应公制0.508mm×0.254mm），属于X7R介质类型，兼顾温度稳定性与成本优势，是消费电子、通信等领域的高性价比选型。
二、核心参数与性能特点
（1）电性能参数
- 容值与精度：标称容值10nF（标识“103K”，“103”表示10×10³pF=10nF，“K”代表精度±10%），满足常规电路对容值精度的需求；
- 额定电压：25V直流额定电压，适用于3.3V、5V等低压供电系统，安全余量充足；
- 温度系数：X7R（EIA标准），工作温度范围-55℃~+125℃，容值变化率控制在±15%以内，比Y5V介质更稳定，比NP0介质更具成本优势。
（2）性能优势
- 宽温稳定：X7R介质在极端温度下容值漂移小，适合汽车电子、工业控制等环境变化大的场景；
- 低损耗：陶瓷介质损耗角正切值（tanδ）低，减少电路能量损耗，提升信号完整性；
- 抗老化：多层陶瓷结构优化，长期工作电压下容值衰减小，可靠性高。
三、封装与物理特性
- 封装尺寸：0201英制封装（长0.508mm×宽0.254mm），是当前MLCC最小封装之一，适配高密度PCB布局；
- 厚度：0.3mm超薄设计，满足智能手表、蓝牙耳机等便携设备“轻薄化”的空间限制；
- 焊接兼容性：端电极采用镍-锡（Ni-Sn）镀层，兼容回流焊、波峰焊工艺，焊接可靠性高，不易虚焊。
四、典型应用场景
（1）消费电子领域
- 智能手机/平板：射频电路去耦、基带芯片周边电源滤波；
- 可穿戴设备：智能手表传感器耦合、蓝牙耳机电池供电滤波；
- 小型家电：遥控器、智能音箱控制电路噪声抑制。
（2）通信与网络设备
- 路由器/交换机：信号耦合电容、电源模块去耦；
- 无线基站：小型化射频模块滤波组件。
（3）工业与汽车电子
- 小型PLC：控制电路信号滤波；
- 汽车低压系统：车载显示屏、传感器辅助滤波（需结合整车电压需求）。
五、品牌与品质保障
三环电子（CCTC）是国内MLCC主流厂商，具备完整研发生产体系：
- 环保合规：符合RoHS 2.0、REACH标准，无铅无卤；
- 一致性管控：自动化生产工艺，容值、尺寸一致性好，适合批量采购；
- 可靠性测试：通过高温老化、湿度循环、机械振动测试，满足工业级需求。
六、选型价值总结
TCC0201X7R103K250ZT的核心价值在于**“小体积+稳定性能+高性价比”**：
- 对比进口品牌（村田、TDK），成本降低15%-20%，适合中低端消费电子批量应用；
- 对比同价位国产品牌，三环X7R介质一致性更好，温度稳定性更可靠；
- 超薄0.3mm厚度+0201封装，解决便携设备空间紧张痛点，是小型化设计优选。
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