WMSIC Electronic Components

CCTC TCC1206X7R474K101FT

ModelTCC1206X7R474K101FT
Package1206
BrandCCTC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
CCTC TCC1206X7R474K101FT
Type
CCTC
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CCTC
Electronic Component
TCC1206X7R474K101FT
Electronic Component
1
Electronic Component
470nF
Package
1206
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.045g
Electronic Component
1
Electronic Component
BM0264907443
Electronic Component
X7R
Voltage
100V
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TCC1206X7R474K101FT 产品概述

1. 产品简介

TCC1206X7R474K101FT 是一款由 CCTC(三环)公司生产的贴片多层陶瓷电容(MLCC),具有高可靠性、优异的电气性能和广泛的应用范围。该电容采用 X7R 介质材料,具有稳定的温度特性和较高的容值,适用于各种电子设备中的滤波、耦合、旁路等电路。

2. 主要参数

  • 商品分类: 贴片电容(MLCC)
  • 容值: 470nF
  • 材质(温度系数): X7R
  • 精度: ±10%
  • 额定电压: 100V
  • 封装: 1206
  • 品牌: CCTC(三环)

3. 技术特点

  • 高容值: 470nF 的容值使其在滤波和储能应用中表现出色。
  • 宽温度范围: X7R 材质提供了从 -55°C 到 +125°C 的宽工作温度范围,确保在各种环境下的稳定性。
  • 高额定电压: 100V 的额定电压使其适用于高压电路。
  • 紧凑封装: 1206 封装尺寸为 3.2mm x 1.6mm,适合高密度 PCB 布局。
  • 高可靠性: 采用优质材料和先进制造工艺,确保产品的高可靠性和长寿命。

4. 应用领域

TCC1206X7R474K101FT 广泛应用于以下领域:

  • 消费电子: 如智能手机、平板电脑、笔记本电脑等设备中的电源管理、信号滤波和去耦电路。
  • 工业控制: 用于工业自动化设备、电机控制、电源模块等。
  • 汽车电子: 适用于汽车电子系统中的电源管理、传感器信号处理等。
  • 通信设备: 用于基站、路由器、交换机等通信设备中的滤波和储能电路。
  • 医疗设备: 在医疗电子设备中用于信号处理和电源管理。

5. 优势与特点

  • 稳定性: X7R 材质提供了优异的温度稳定性,确保在不同温度环境下电容值的稳定。
  • 高耐压: 100V 的额定电压使其适用于高压应用,提高了电路的安全性。
  • 紧凑设计: 1206 封装尺寸小,适合高密度 PCB 设计,节省空间。
  • 高可靠性: 采用优质材料和先进制造工艺,确保产品的高可靠性和长寿命。

6. 技术规格

  • 容值: 470nF
  • 精度: ±10%
  • 温度系数: X7R (-55°C to +125°C)
  • 额定电压: 100V
  • 封装尺寸: 1206 (3.2mm x 1.6mm)
  • 工作温度范围: -55°C to +125°C
  • 介质材料: X7R

7. 使用注意事项

  • 焊接: 建议使用回流焊或波峰焊工艺,避免过热导致电容损坏。
  • 存储: 应存放在干燥、无尘的环境中,避免高温和高湿度。
  • 应用: 在设计电路时,应考虑电容的额定电压和温度特性,确保其在安全范围内工作。

8. 结论

TCC1206X7R474K101FT 是一款高性能的贴片多层陶瓷电容,具有高容值、宽温度范围和高额定电压等特点,适用于各种电子设备中的滤波、耦合、旁路等电路。其紧凑的封装尺寸和高可靠性使其成为高密度 PCB 设计的理想选择。无论是消费电子、工业控制、汽车电子还是通信设备,TCC1206X7R474K101FT 都能提供稳定可靠的性能,满足各种应用需求。

通过以上概述,可以看出 TCC1206X7R474K101FT 在电子元器件市场中具有广泛的应用前景和优异的性能表现,是工程师和设计师在电路设计中的理想选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.