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CCTC TCC0805X5R335K350FT
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- CCTC TCC0805X5R335K350FT
- Type
- CCTC
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- CCTC
- Electronic Component
- TCC0805X5R335K350FT
- Electronic Component
- 1
- Electronic Component
- 3.3uF
- Package
- 0805
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.038g
- Electronic Component
- 1
- Electronic Component
- BM0264935513
- Electronic Component
- X5R
- Voltage
- 35V
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TCC0805X5R335K350FT 产品概述
一、产品简介
TCC0805X5R335K350FT 是三环（CCTC）品牌的一款贴片多层陶瓷电容（MLCC），封装规格为 0805（约 2.0 × 1.25 mm）。额定电容为 3.3 µF，初始容差 ±10%，额定电压 35 V，介质类型为 X5R。该型号面向中高电容量、空间受限且需要较好温度稳定性的去耦与旁路应用。
二、主要电气参数
- 容值：3.3 µF（标称）
- 容值精度：±10%
- 额定电压：35 V DC
- 介质：X5R（工作温度范围通常为 -55°C 至 +85°C）
- 封装：0805（2012 公制）
- 表面处理：适用于常规回流焊工艺，符合无铅（RoHS）要求
三、性能特点与注意事项
- X5R 介质在宽温度范围内能保持中等稳定性，适合电源去耦与旁路用途，但随温度变化会有一定容值漂移。
- 陶瓷类电容在加直流偏压时容值会下降，3.3 µF/0805 在接近其额定电压时可能出现明显的有效容量降低，应在系统中通过实验验证实际工作容值。
- 等效串联电阻（ESR）极低，适合抑制高频噪声；但 0805 小封装的纹波电流承受能力有限，若用于高功率纹波吸收需注意温升与可靠性。
四、典型应用场景
- 数字与模拟电路的电源去耦（VCC、LDO 输出端、稳压器输入输出）。
- 开关电源的小体积旁路与滤波。
- 通信与消费类电子中需要中等电容量的去耦场合。
- 空间受限的电路板设计，希望兼顾容量与封装尺寸的场景。
五、封装与装配建议
- 尽量将电容贴近 IC 电源引脚放置并减少走线长度，以降低寄生电感和提升去耦效果。
- 使用短而宽的焊盘并在必要时配置多孔过孔以改善散热和电流承载。
- 遵循器件厂家的回流焊温度曲线，避免超出温度峰值时间导致内部裂纹。
- 贴装与波峰/回流工艺后建议进行视觉/显微检查以排查焊接缺陷和裂纹风险。
六、可靠性与选型建议
- 在设计阶段通过实际板级测试验证工作电压和温度下的有效容值与纹波耐受能力。
- 若对容量保留要求较高或工作电压接近 35 V，建议评估更高额定电压或更大封装的方案以减少 DC-bias 带来的容值损失。
- 可参考同规格 X5R 体系下的其他厂商 0805 3.3 µF/35 V 器件作为替代件，但需比对实际 DC-bias、ESR、热稳定性与可靠性测试数据。
如需器件数据手册、回流曲线或 tape-and-reel 包装信息，可提供后续资料以便精确选型与生产准备。
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