Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
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TCC0805X7R103K501DTS 是一款由 CCTC(三环)公司生产的贴片多层陶瓷电容器(MLCC),具有高额定电压和稳定的温度特性。该电容器广泛应用于各种电子设备中,特别是在需要高电压和高可靠性的场合。
TCC0805X7R103K501DTS 的标称容值为 10nF,精度为 ±10%。这意味着在实际应用中,电容值可能在 9nF 到 11nF 之间波动。这种精度适用于大多数通用电子电路,特别是在对电容值要求不十分严格的场合。
该电容器采用 X7R 材质,具有较好的温度稳定性。X7R 材质的温度系数为 ±15%,在 -55°C 到 +125°C 的温度范围内,电容值的变化不超过 ±15%。这使得 TCC0805X7R103K501DTS 能够在较宽的温度范围内保持稳定的性能,适用于各种环境条件下的应用。
TCC0805X7R103K501DTS 的额定电压为 500V,这意味着它可以在高达 500V 的电压下正常工作而不会发生击穿或损坏。这种高额定电压使得该电容器特别适用于高压电路,如电源滤波、高压信号耦合等场合。
该电容器采用 0805 封装,尺寸为 2.0mm x 1.25mm。这种封装尺寸在贴片电容器中属于中等大小,既便于自动化生产中的贴装,又能在有限的空间内提供足够的电容值。
TCC0805X7R103K501DTS 由于其高额定电压和稳定的温度特性,广泛应用于以下领域:
TCC0805X7R103K501DTS 由 CCTC(三环)公司生产,该公司在电子元器件领域具有较高的声誉和丰富的生产经验。CCTC 的产品以高质量和可靠性著称,通过了多项国际质量认证,如 ISO9001、ISO14001 等。因此,TCC0805X7R103K501DTS 在质量和性能上具有较高的保障。
TCC0805X7R103K501DTS 是一款高性能的贴片多层陶瓷电容器,具有 10nF 的容值、±10% 的精度、500V 的额定电压和 X7R 材质的温度特性。其 0805 封装尺寸便于自动化生产,适用于各种高压和高可靠性的电子设备中。CCTC(三环)公司的品牌保证进一步确保了该产品的高质量和可靠性。无论是在电源管理、高压电路、通信设备还是工业控制领域,TCC0805X7R103K501DTS 都能提供稳定和可靠的电容支持。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
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The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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