WMSIC Electronic Components

CCTC TCC1206COG330J500DT

ModelTCC1206COG330J500DT
Package1206
BrandCCTC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
CCTC TCC1206COG330J500DT
Type
CCTC
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CCTC
Electronic Component
TCC1206COG330J500DT
Electronic Component
1
Electronic Component
33pF
Package
1206
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±5%
Electronic Component
0.045g
Electronic Component
1
Electronic Component
BM0265124340
Electronic Component
C0G
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TCC1206COG330J500DT 产品概述

产品简介

TCC1206COG330J500DT 是一款由 CCTC(三环)公司生产的贴片多层陶瓷电容器(MLCC),具有高精度、高稳定性和优异的温度特性。该电容器广泛应用于各种电子设备中,特别是在需要高可靠性和稳定性的电路中,如射频(RF)电路、滤波电路、振荡电路等。

主要参数

  • 商品分类: 贴片电容(MLCC)
  • 容值: 33pF
  • 材质(温度系数): C0G(NP0)
  • 精度: ±5%
  • 额定电压: 50V
  • 封装: 1206(3216 公制)
  • 品牌: CCTC(三环)

产品特点

  1. 高精度: 该电容器的容值精度为±5%,确保了电路设计的精确性和一致性。
  2. 优异的温度特性: 采用 C0G(NP0)材质,具有极低的温度系数,在宽温度范围内保持稳定的电容值,适用于高精度和高稳定性的应用。
  3. 高额定电压: 额定电压为50V,适用于中高压电路设计,提供更高的安全裕度。
  4. 小型化封装: 采用1206(3216 公制)封装,体积小巧,适合高密度PCB布局,节省空间。
  5. 高可靠性: CCTC(三环)作为知名品牌,产品质量可靠,经过严格的质量控制和测试,确保长期稳定运行。

应用领域

TCC1206COG330J500DT 适用于多种电子设备和电路,包括但不限于:

  • 射频(RF)电路: 用于匹配、滤波和调谐电路,提供稳定的电容值。
  • 滤波电路: 用于电源滤波和信号滤波,减少噪声和干扰。
  • 振荡电路: 用于时钟电路和振荡器,提供稳定的频率输出。
  • 高精度仪器: 用于需要高精度和稳定性的测量仪器和测试设备。

技术细节

  • 温度系数: C0G(NP0)材质的温度系数为0±30ppm/°C,在-55°C至+125°C的温度范围内保持稳定的电容值。
  • 介质材料: 采用高质量的陶瓷介质,具有低损耗和高介电常数,确保电容器的性能。
  • 电极材料: 使用高导电率的电极材料,减少等效串联电阻(ESR),提高电容器的效率。
  • 焊接性能: 具有良好的焊接性能,适合回流焊和波峰焊工艺,确保在PCB上的可靠连接。

质量保证

CCTC(三环)公司严格按照国际标准进行生产和测试,确保每一颗 TCC1206COG330J500DT 电容器都符合高质量要求。产品通过多项可靠性测试,包括温度循环测试、湿度测试、机械冲击测试等,确保在各种恶劣环境下都能稳定工作。

包装与存储

  • 包装: 产品通常以卷带包装,便于自动化贴片设备使用。
  • 存储条件: 建议存储在干燥、无尘的环境中,避免高温和高湿度,以保持产品的最佳性能。

总结

TCC1206COG330J500DT 是一款高性能的贴片多层陶瓷电容器,具有高精度、高稳定性和优异的温度特性。适用于多种电子设备和电路,特别是在需要高可靠性和稳定性的应用中表现出色。CCTC(三环)公司的高质量保证和严格的生产控制,使得该产品成为工程师和设计师的理想选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.