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CCTC TCC1206X5R476M100HT
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- CCTC TCC1206X5R476M100HT
- Type
- CCTC
- Minimum package
- 2000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- CCTC
- Electronic Component
- TCC1206X5R476M100HT
- Electronic Component
- 1
- Electronic Component
- 47uF
- Package
- 1206
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±20%
- Electronic Component
- 0.074g
- Electronic Component
- 1
- Electronic Component
- BM0264968317
- Electronic Component
- X5R
- Voltage
- 10V
- Electronic Component
- Electronic Component
- Electronic Component
- 2000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TCC1206X5R476M100HT 产品概述
一、产品简介
TCC1206X5R476M100HT 为 CCTC（三环）系列贴片多层陶瓷电容（MLCC），标称容量 47µF，额定电压 10V，容量公差 ±20%，温度特性为 X5R。1206 封装体积小、容量密度高，适合在空间受限的电路板上实现大容量去耦与能量储存。
二、主要参数
- 容值：47µF
- 公差：±20%
- 额定电压：10V DC
- 温度特性：X5R（适用温度范围 -55°C 至 +85°C，温度下容量有一定变化但属中等稳定性）
- 封装：1206（俗称 3216 公制，约 3.2mm × 1.6mm）
- 品牌：CCTC（三环）
三、典型特性与优势
- 高容量密度：在 1206 封装中提供较大电容值，便于电源去耦与滤波。
- 中等温度稳定性：X5R 介质在常见工作温度范围内保持较稳定的容量，适合多数消费与工业类应用。
- SMT 工艺兼容：适用于常规回流焊流程，便于自动化贴装与批量生产。
- 成本与性能平衡：相较于高稳定性陶瓷（如 C0G/NPO），X5R 在容量/体积比与成本上具有优势。
四、典型应用
- 开关电源输入/输出去耦与储能
- 电源稳压电路与负载瞬态响应优化
- 移动设备、通信设备、计算机及外围模块的滤波与旁路
- 工业与消费类电子中对温度稳定性要求中等的场景
五、封装与可靠性
1206 封装兼顾机械强度与容量，适合自动贴装。建议根据 PCB 应力与可靠性要求进行抗裂评估并合理布局（避免直接在有应力的焊盘边缘放置大容量片式电容）。如用于关键或严苛环境，建议参考厂方完整可靠性报告并进行温度循环、湿热与机械应力测试。
六、选型与使用建议
- 若电路对容量精度或温度稳定性要求更高，可考虑更稳定的介质类型或更宽压降裕度。
- 进行去耦时，可与小容量、低 ESL 的 MLCC 串联并联组合以优化高频与低频性能。
- 焊接请遵循厂方回流曲线与 PCB 处理规范，避免过度热应力与机械应力导致裂纹。
如需完整数据手册（尺寸图、温度-电压特性、ESR/ESL、寿命与可靠性测试数据），建议向 CCTC 官方或授权代理索取原厂数据表。
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