WMSIC Electronic Components

CCTC TCC0603X5R475K6R3CT

ModelTCC0603X5R475K6R3CT
Package0603
BrandCCTC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
CCTC TCC0603X5R475K6R3CT
Type
CCTC
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CCTC
Electronic Component
TCC0603X5R475K6R3CT
Electronic Component
1
Electronic Component
4.7uF
Package
0603
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.035g
Electronic Component
1
Electronic Component
BM0265134751
Electronic Component
X5R
Voltage
6.3V
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CCTC三环TCC0603X5R475K6R3CT贴片电容(MLCC)产品概述

一、产品基本信息

CCTC三环TCC0603X5R475K6R3CT是一款多层陶瓷贴片电容(MLCC),隶属于三环电子(CCTC)的常规民用级MLCC系列。型号各部分含义明确,便于工程选型:

  • TCC:三环电子MLCC产品系列标识;
  • 0603:英制封装代码(对应公制1608),代表封装尺寸;
  • X5R:温度系数类别,定义产品的温度-容量特性;
  • 475:容值代码,换算为实际容值=47×10⁵ pF=4.7 μF;
  • K:容值精度等级,对应±10%;
  • 6R3:额定直流电压,即6.3 V;
  • CT:产品常规等级后缀,代表标准封装与性能配置。

该产品针对小体积、常规温度环境下的电子电路设计,是消费电子、便携式设备等领域的通用被动元件。

二、核心性能参数

产品核心参数严格遵循三环电子质量规范与行业标准,具体如下:

参数项 规格值 备注 类型 多层陶瓷贴片电容(MLCC) 无极性,陶瓷介质 封装 0603(英制)/1608(公制) 长×宽≈1.6mm×0.8mm 额定电压(DC) 6.3 V 最大持续工作电压 标称容值 4.7 μF 475代码换算(47×10⁵ pF) 容值精度 ±10%(K档) 25℃常温下的精度要求 温度系数(X5R) -55℃~+85℃,容量变化±15% 行业X5R标准温度特性 损耗角正切(tanδ) ≤5%(1kHz,25℃) 典型值,随频率略有波动 端电极镀层 Ni/Sn(镍锡) 符合RoHS 2.0环保要求

三、封装与尺寸规格

0603封装是当前电子设备中应用最广泛的小尺寸封装之一,该产品的封装细节如下:

  • 尺寸(公制):长1.6±0.1mm,宽0.8±0.1mm,厚度0.8±0.1mm(典型值,因生产批次略有差异);
  • 端电极结构:采用三层镀层(Ni底层+Ni阻挡层+Sn表面层),确保焊接可靠性与耐腐蚀性;
  • 介质材料:钛酸钡基陶瓷介质,无有害重金属添加,符合环保要求。

小体积设计使其可适配高密度PCB布局,满足智能手机、智能穿戴等设备的小型化需求。

四、典型应用场景

结合产品的电压、容值与封装特性,该电容适用于以下场景:

  1. 消费电子终端:智能手机、平板电脑的电源滤波(如电池供电电路、逻辑单元去耦)、音频信号耦合;
  2. 便携式设备:无线耳机、智能手环的信号路径滤波、电源稳压辅助;
  3. 物联网节点:低功耗传感器(温湿度、运动传感器)的电源去耦、信号匹配;
  4. 车载电子(低压部分):仪表盘背光控制电路、车载USB接口滤波;
  5. 电脑周边:无线鼠标、键盘的电源滤波、蓝牙模块信号耦合。

五、关键特性总结

该产品具备以下核心优势,适配大多数常规电子电路设计:

  1. 小体积高密度:0603封装实现小尺寸下的4.7μF容值,适合紧凑PCB布局;
  2. 温度稳定性适中:X5R温度特性覆盖-55℃至+85℃宽温范围,容量变化可控;
  3. 精度可靠:±10%精度覆盖90%以上的常规电路需求,无需额外校准;
  4. 环保合规:符合RoHS 2.0、REACH等国际标准,无铅无镉;
  5. 焊接兼容性强:适配回流焊、波峰焊等主流贴片工艺,焊接良率≥99%;
  6. 低损耗低噪声:陶瓷介质损耗低,适合信号路径与电源滤波,减少噪声干扰。

六、可靠性与环境适应性

三环电子对该产品的可靠性进行了全面验证,符合IEC、JIS等国际标准:

  1. 温度循环测试:-55℃~+85℃循环1000次后,容值变化≤±10%,性能稳定;
  2. 湿度老化测试:85℃/85%RH环境下工作1000小时,容值变化≤±12%,绝缘电阻≥10⁹ Ω;
  3. 机械可靠性:抗振动(10~2000Hz,加速度10g)、抗冲击(1000g/1ms)测试后无开路/短路;
  4. 寿命预测:额定条件(25℃,6.3V DC)下,平均寿命可达10⁶小时以上,满足长期使用需求。

该产品凭借稳定的性能、紧凑的尺寸与可靠的质量,成为消费电子、物联网等领域的高性价比选型。

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