Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CCTC三环TCC0603X5R475K6R3CT是一款多层陶瓷贴片电容(MLCC),隶属于三环电子(CCTC)的常规民用级MLCC系列。型号各部分含义明确,便于工程选型:
该产品针对小体积、常规温度环境下的电子电路设计,是消费电子、便携式设备等领域的通用被动元件。
产品核心参数严格遵循三环电子质量规范与行业标准,具体如下:
参数项 规格值 备注 类型 多层陶瓷贴片电容(MLCC) 无极性,陶瓷介质 封装 0603(英制)/1608(公制) 长×宽≈1.6mm×0.8mm 额定电压(DC) 6.3 V 最大持续工作电压 标称容值 4.7 μF 475代码换算(47×10⁵ pF) 容值精度 ±10%(K档) 25℃常温下的精度要求 温度系数(X5R) -55℃~+85℃,容量变化±15% 行业X5R标准温度特性 损耗角正切(tanδ) ≤5%(1kHz,25℃) 典型值,随频率略有波动 端电极镀层 Ni/Sn(镍锡) 符合RoHS 2.0环保要求0603封装是当前电子设备中应用最广泛的小尺寸封装之一,该产品的封装细节如下:
小体积设计使其可适配高密度PCB布局,满足智能手机、智能穿戴等设备的小型化需求。
结合产品的电压、容值与封装特性,该电容适用于以下场景:
该产品具备以下核心优势,适配大多数常规电子电路设计:
三环电子对该产品的可靠性进行了全面验证,符合IEC、JIS等国际标准:
该产品凭借稳定的性能、紧凑的尺寸与可靠的质量,成为消费电子、物联网等领域的高性价比选型。
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Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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