Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
CCTC TCC1206M3L223J500FT
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
17
specifications
Core information
- Product name
- CCTC TCC1206M3L223J500FT
- Type
- CCTC
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- CCTC
- Electronic Component
- TCC1206M3L223J500FT
- Electronic Component
- 1
- Electronic Component
- 22nF
- Package
- 1206
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±5%
- Electronic Component
- 0.043g
- Electronic Component
- 1
- Electronic Component
- BM0264907306
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TCC1206M3L223J500FT 贴片多层陶瓷电容（MLCC）产品概述
一、产品基本定位与品牌背景
TCC1206M3L223J500FT是三环电子（CCTC） 推出的通用型贴片多层陶瓷电容（MLCC），覆盖工业级与消费级应用场景。型号代码解析：
- 1206：英制贴片封装尺寸（公制3216）；
- M3L：温度特性分类（对应-55℃~+125℃工作范围）；
- 223：容值22nF（10³pF）；
- J：精度±5%；
- 500：额定电压50V DC；
- FT：生产工艺与卷带包装标识。
三环作为国内MLCC核心供应商，产能覆盖0402~1812全系列封装，在中低端通用市场具备稳定性价比优势。
二、核心电气性能参数详解
该电容关键指标符合行业规范，具体如下：
参数 规格值 测试条件 标称容值 22nF（223） 1kHz/25℃ 精度 ±5%（J级） 标准直流测试 额定电压 50V DC 长期工作电压上限 温度特性 -55℃~+125℃，容值变化±10% 125℃下24h老化后测试 损耗角正切（DF） <1%（典型值） 1kHz/25℃ 绝缘电阻 ≥10⁹Ω（25℃）；≥10⁷Ω（125℃） 直流50V测试三、封装与机械特性
采用1206英制贴片封装，尺寸为：长3.2mm±0.2mm、宽1.6mm±0.2mm、厚1.0mm±0.1mm（批次略有差异）。端电极采用「镍底层+纯锡镀层」结构，符合RoHS 2.0/REACH环保要求，兼容主流焊接工艺：
- 回流焊：峰值温度230℃~240℃，焊接时间≤10秒；
- 机械强度：PCB弯曲半径≥1mm时无失效，满足常规组装需求；
- 包装：卷带式（8mm编带），每盘4000~5000pcs，适配自动化贴装。
四、典型应用场景
作为通用型MLCC，该型号广泛应用于：
- 消费电子：手机/平板的电源去耦、音频线路耦合；
- 工业控制：PLC、变频器的信号滤波、低压电源稳压；
- 通信设备：路由器/交换机的电源噪声抑制、数据线路耦合；
- 小型家电：智能插座、加湿器的控制电路滤波；
- 汽车辅助系统：车载中控、倒车影像的低压滤波（需确认是否需汽车级认证）。
五、可靠性与供应链优势
三环该型号具备以下竞争力：
- 可靠性测试：通过1000h@125℃+50V高温寿命测试（失效率<1%）、85℃/85%RH湿热测试（性能无衰减）；
- 供应链稳定：国内多基地产能，交货周期2~4周，支持批量采购；
- 成本优势：相比进口品牌（村田/TDK）性价比提升15%~20%；
- 认证齐全：ISO9001/14001、RoHS、UL安全认证。
六、选型与使用注意事项
- 电压余量：实际工作电压≤40V（额定电压80%），避免过压击穿；
- 温度匹配：M3L不适合>125℃或<-55℃场景，极端环境选X7R/X8R；
- 焊接防护：受潮电容需105℃/24h烘烤，避免回流焊爆浆；
- 机械应力：焊接后避免PCB弯曲、跌落，防止电容开裂；
- 存储条件：25℃±5℃、湿度≤60%RH环境存储，有效期12个月。
该型号以高性价比、稳定可靠性成为中低端电子设备的常规选型，适合对成本敏感且环境要求不极端的应用场景。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
