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Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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TCC1206X7R471K102DTS 是一款由 CCTC(三环)公司生产的贴片多层陶瓷电容(MLCC),具有高电压、高稳定性和优异的温度特性。该电容广泛应用于各种电子设备中,特别是在需要高电压和高可靠性的场合,如电源管理、滤波、耦合和去耦等应用。
TCC1206X7R471K102DTS 的标称容值为 470pF,精度为 ±10%。这意味着在实际应用中,电容的容值可以在 423pF 到 517pF 之间波动。这种精度水平适用于大多数通用电子电路,特别是在对容值要求不是非常严格的场合。
该电容采用 X7R 材质,具有优异的温度稳定性。X7R 材质的温度系数为 ±15%,在 -55°C 到 +125°C 的温度范围内,电容的容值变化不超过 ±15%。这使得 TCC1206X7R471K102DTS 能够在宽温度范围内保持稳定的性能,适用于各种环境条件。
TCC1206X7R471K102DTS 的额定电压为 1kV,这意味着它可以在高达 1000V 的电压下正常工作。这种高电压特性使其非常适合用于高压电源、高压滤波和其他需要高电压耐受能力的应用。
该电容采用 1206 封装,尺寸为 3.2mm x 1.6mm。这种封装尺寸在贴片电容中属于中等大小,既保证了足够的电容量和电压耐受能力,又便于在紧凑的电路板上进行布局和焊接。
TCC1206X7R471K102DTS 广泛应用于以下领域:
TCC1206X7R471K102DTS 由 CCTC(三环)公司生产,CCTC 是一家在电子元器件领域具有悠久历史和良好声誉的公司。CCTC 的产品以高质量、高可靠性和优异的性能著称,广泛应用于全球各地的电子设备中。
TCC1206X7R471K102DTS 是一款高性能的贴片多层陶瓷电容,具有高电压、高稳定性和优异的温度特性。其 470pF 的容值、±10% 的精度、1kV 的额定电压和 1206 封装尺寸,使其非常适合用于各种电子设备中的电源管理、滤波、耦合和去耦等应用。CCTC 公司的高品质保证,使得 TCC1206X7R471K102DTS 成为工程师和设计师在高压和高可靠性应用中的理想选择。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
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Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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