Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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TCC1206COG102J500DT 是一款由CCTC(三环)公司生产的贴片多层陶瓷电容(MLCC),具有高精度、高稳定性和优异的温度特性。该电容广泛应用于各种电子设备中,特别是在需要高可靠性和稳定性的电路中。
TCC1206COG102J500DT 的标称容值为1nF,精度为±5%。这意味着在实际应用中,电容的容值会在0.95nF到1.05nF之间波动。这种高精度使得该电容非常适合用于需要精确电容值的电路,如滤波电路、振荡电路和定时电路。
该电容采用C0G(也称为NP0)材质,这种材质具有极低的温度系数,通常在±30ppm/°C范围内。C0G材质的电容在宽温度范围内(通常为-55°C到+125°C)表现出极佳的稳定性,几乎不受温度变化的影响。因此,TCC1206COG102J500DT 非常适合用于高温环境或温度变化较大的应用场景。
TCC1206COG102J500DT 的额定电压为50V,这意味着在正常工作条件下,电容可以承受的最大电压为50V。在实际应用中,建议工作电压不超过额定电压的80%,以确保电容的长期可靠性和稳定性。
该电容采用1206封装,尺寸为3.2mm x 1.6mm。这种封装尺寸在贴片电容中属于中等大小,既适合手工焊接,也适合自动化贴片生产。1206封装的电容在PCB板上占用空间较小,有助于提高电路板的集成度。
TCC1206COG102J500DT 由于其高精度、高稳定性和优异的温度特性,广泛应用于以下领域:
TCC1206COG102J500DT 由CCTC(三环)公司生产,CCTC是中国领先的电子元器件制造商之一,以其高质量和可靠性著称。CCTC的产品经过严格的质量控制和测试,确保每一颗电容都符合国际标准,能够满足各种严苛的应用需求。
TCC1206COG102J500DT 是一款高性能的贴片多层陶瓷电容,具有1nF的容值、±5%的精度、50V的额定电压和C0G材质。其优异的温度特性和高精度使其广泛应用于通信设备、消费电子、工业控制和汽车电子等领域。CCTC品牌的质量保证进一步确保了该电容在各种应用中的可靠性和稳定性。无论是设计工程师还是生产制造商,TCC1206COG102J500DT 都是一个值得信赖的选择。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
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Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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