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CCTC TCC0805COG102J500BT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- CCTC TCC0805COG102J500BT
- Type
- CCTC
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- CCTC
- Electronic Component
- TCC0805COG102J500BT
- Electronic Component
- 1
- Electronic Component
- 1nF
- Package
- 0805
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±5%
- Electronic Component
- 0.068g
- Electronic Component
- 1
- Electronic Component
- BM0264756962
- Electronic Component
- C0G
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TCC0805COG102J500BT 产品概述
1. 产品简介
TCC0805COG102J500BT 是一款由CCTC（三环）公司生产的贴片多层陶瓷电容（MLCC），具有1nF的容值，采用C0G（NPO）材质，精度为±5%，额定电压为50V，封装形式为0805。该电容以其高稳定性、低损耗和优异的温度特性，广泛应用于各种电子设备中，特别是在需要高精度和高可靠性的电路中。
2. 产品特点
- 高稳定性：采用C0G（NPO）材质，具有极低的温度系数，确保在不同温度环境下电容值的稳定性。
- 低损耗：低ESR（等效串联电阻）和低DF（损耗因数），适用于高频电路。
- 高精度：容值精度为±5%，满足高精度电路设计的需求。
- 高额定电压：额定电压为50V，适用于多种电压环境。
- 小型化封装：0805封装，尺寸为2.0mm x 1.25mm，厚度为0.6mm，适合高密度PCB布局。
3. 技术参数
- 商品分类：贴片电容（MLCC）
- 容值：1nF
- 材质（温度系数）：C0G（NPO）
- 精度：±5%
- 额定电压：50V
- 封装：0805
- 厚度：0.6mm
- 品牌：CCTC（三环）
4. 应用领域
TCC0805COG102J500BT 广泛应用于以下领域：
- 通信设备：用于射频电路、滤波器、振荡器等，提供稳定的电容值。
- 消费电子：用于智能手机、平板电脑、数码相机等，满足高精度和高可靠性的需求。
- 工业控制：用于PLC、传感器、电机控制等，确保电路的稳定运行。
- 汽车电子：用于车载娱乐系统、导航系统、发动机控制单元等，适应严苛的工作环境。
- 医疗设备：用于医疗仪器、诊断设备等，提供高精度和高可靠性的电容。
5. 产品优势
- 高可靠性：C0G（NPO）材质具有优异的温度特性和长期稳定性，确保产品在各种环境下的可靠性。
- 低损耗：低ESR和低DF，适用于高频电路，减少能量损耗。
- 高精度：±5%的容值精度，满足高精度电路设计的需求。
- 高额定电压：50V的额定电压，适用于多种电压环境。
- 小型化封装：0805封装，适合高密度PCB布局，节省空间。
6. 使用注意事项
- 焊接条件：建议使用回流焊或波峰焊，焊接温度和时间应符合相关标准，避免过热导致电容损坏。
- 存储条件：应存放在干燥、无尘、无腐蚀性气体的环境中，避免高温和高湿。
- 使用环境：避免在超出额定电压和温度范围的环境中使用，以免影响电容的性能和寿命。
7. 结论
TCC0805COG102J500BT 是一款高性能的贴片多层陶瓷电容，具有高稳定性、低损耗、高精度和高额定电压等特点，广泛应用于通信设备、消费电子、工业控制、汽车电子和医疗设备等领域。其小型化封装和高可靠性，使其成为高密度PCB布局和高精度电路设计的理想选择。
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