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CCTC TCC0805X5R475K250FT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- CCTC TCC0805X5R475K250FT
- Type
- CCTC
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- CCTC
- Electronic Component
- TCC0805X5R475K250FT
- Electronic Component
- 1
- Electronic Component
- 4.7uF
- Package
- 0805
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.068g
- Electronic Component
- 1
- Electronic Component
- BM0265024083
- Electronic Component
- X5R
- Voltage
- 25V
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：TCC0805X5R475K250FT 贴片电容（MLCC）
1. 产品简介
TCC0805X5R475K250FT 是一款由 CCTC（三环）公司生产的贴片多层陶瓷电容（MLCC），具有高容量、高电压和优异的温度稳定性。该电容广泛应用于各种电子设备中，特别是在需要高可靠性和稳定性的电路中。其紧凑的0805封装使其非常适合空间受限的应用场景。
2. 主要参数
- 商品分类: 贴片电容（MLCC）
- 容值: 4.7µF
- 材质（温度系数）: X5R
- 精度: ±10%
- 额定电压: 25V
- 封装: 0805（2.0mm x 1.25mm）
3. 技术特性
- 高容量: 4.7µF的容值使其能够在电路中提供足够的电荷存储能力，适用于滤波、去耦和储能等应用。
- 温度稳定性: 采用X5R材质，该电容在-55°C至+85°C的温度范围内表现出稳定的电容值变化，确保在各种环境条件下都能可靠工作。
- 高电压额定值: 25V的额定电压使其能够承受较高的电压应力，适用于多种电源和信号处理电路。
- 紧凑封装: 0805封装尺寸为2.0mm x 1.25mm，适合高密度PCB布局，节省空间。
4. 应用领域
TCC0805X5R475K250FT 贴片电容广泛应用于以下领域：
- 消费电子: 如智能手机、平板电脑、笔记本电脑等，用于电源管理、信号滤波和去耦。
- 工业电子: 在工业控制设备、自动化系统中用于稳定电源和信号处理。
- 汽车电子: 在汽车电子控制单元（ECU）、传感器和娱乐系统中提供可靠的电容性能。
- 通信设备: 在基站、路由器和交换机中用于高频滤波和去耦。
5. 品牌与质量保证
CCTC（三环）作为知名的电子元器件制造商，以其高质量和可靠性著称。TCC0805X5R475K250FT 贴片电容经过严格的质量控制和测试，确保其符合国际标准，提供长期稳定的性能。
6. 使用注意事项
- 焊接: 建议使用回流焊工艺，确保焊接质量，避免过热导致电容损坏。
- 存储: 应存放在干燥、无尘的环境中，避免高温和潮湿。
- 工作环境: 确保工作温度在-55°C至+85°C范围内，避免超出额定电压使用。
7. 总结
TCC0805X5R475K250FT 贴片电容凭借其高容量、高电压和优异的温度稳定性，成为各种电子设备中的理想选择。其紧凑的0805封装和高可靠性使其在空间受限和高密度布局的应用中表现出色。CCTC（三环）的品牌保证进一步确保了该电容的长期稳定性和可靠性，是工程师和设计师在电子设计中的优选元件。
通过以上概述，可以看出 TCC0805X5R475K250FT 贴片电容在多个应用场景中都能提供卓越的性能和可靠性，满足现代电子设备对高密度、高性能元器件的需求。
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