Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
CCTC TCC1206X5R107M6R3HT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- CCTC TCC1206X5R107M6R3HT
- Type
- CCTC
- Minimum package
- 2000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- CCTC
- Electronic Component
- TCC1206X5R107M6R3HT
- Electronic Component
- 1
- Electronic Component
- 100uF
- Package
- 1206
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±20%
- Electronic Component
- 0.087g
- Electronic Component
- 1
- Electronic Component
- BM0265115708
- Electronic Component
- X5R
- Voltage
- 6.3V
- Electronic Component
- Electronic Component
- Electronic Component
- 2000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TCC1206X5R107M6R3HT 产品概述
一、产品简介
TCC1206X5R107M6R3HT 为 CCTC（三环）系列贴片多层陶瓷电容（MLCC），标称电容量 100 μF，公差 ±20%，额定电压 6.3 V，介质材料为 X5R。器件采用 1206 封装（公制约 3.2 mm × 1.6 mm），适合对体积、性能有较高要求的消费电子与工业类电源旁路与储能场景。
二、主要电气性能
- 电容量：100 μF（标称）
- 公差：±20%（M）
- 额定电压：6.3 V DC
- 介质：X5R（工作温度范围通常 -55°C 至 +85°C，介质温漂约 ±15%）
- 低等效串联电阻（ESR），适用于高频去耦与低阻抗电源回路。
需注意：大容量 MLCC 在直流偏压下会出现显著电容量下降，应参考厂方 DC-bias 曲线进行裕量设计。
三、关键特性与优势
- 高容值与小封装的组合，节省 PCB 面积，适合空间受限的移动与便携设备。
- X5R 介质在常用温度范围内保持相对稳定的电容量，适合作为旁路/滤波/储能元件。
- 低 ESR/低 ESL，有利于抑制电源噪声与提高瞬态响应能力。
- 贴片化生产，兼容自动贴装与回流焊工艺，良好的产线适配性。
四、封装与机械特性
1206（3216 公制）外形便于标准 SMT 工艺装配，厚度与端子结构请参照厂家数据手册以确认最大高度与焊盘推荐尺寸。为保证可靠性，布线时应避免将器件置于可能发生弯曲或振动的 PCB 边缘位置。
五、典型应用与布局建议
适用于：移动设备电源去耦、DC-DC 稳压器输入/输出旁路、汽车电子（需确认是否有车辆级认证）、通信设备、消费类电子主板滤波与能量储存。布局建议：尽量靠近电源引脚布置，短而粗的回流路径，必要时与小容量高频电容并联以覆盖更宽频带的噪声抑制。
六、使用注意与可靠性
- DC-bias：100 μF 在 6.3 V 偏压下的有效电容量会明显下降，设计时应留有裕度并参考厂家 DC-bias 曲线。
- 温度效应：X5R 在极端环境下仍有容值变化，关键电路需评估工作温区内的容值保有率。
- 焊接：推荐按 JEDEC/IPC 的回流曲线进行焊接，峰值温度与升温速率以厂家指南为准，避免热冲击与机械应力。
- 存储：干燥保存，避免节外力碰撞；若需汽车级或特殊可靠性证书，应向供应商确认是否符合 AEC-Q200 等标准。
七、采购与验证建议
在项目导入前，向供应商索取完整数据手册、DC-bias 与频率响应曲线、可靠性与寿命测试报告；建议在目标系统中做样品验证（温度循环、老化、实装电源性能测试）以确认在实际工况下的表现。如需汽车级或更严格的品质保证，请与 CCTC 供应链沟通具体认证与批量交付能力。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
