WMSIC Electronic Components

CCTC TCC0805X7R102K500DTS

ModelTCC0805X7R102K500DTS
Package0805
BrandCCTC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
CCTC TCC0805X7R102K500DTS
Type
CCTC
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CCTC
Electronic Component
TCC0805X7R102K500DTS
Electronic Component
1
Electronic Component
1nF
Package
0805
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.068g
Electronic Component
1
Electronic Component
BM0265399108
Electronic Component
X7R
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TCC0805X7R102K500DTS 产品概述

1. 产品简介

TCC0805X7R102K500DTS 是一款由 CCTC(三环)公司生产的贴片多层陶瓷电容(MLCC),具有高可靠性和优异的电气性能。该电容广泛应用于各种电子设备中,特别是在需要高稳定性和低损耗的电路中。其设计符合现代电子设备对小型化、高性能的要求,适用于消费电子、通信设备、工业控制等多个领域。

2. 主要参数

  • 商品分类: 贴片电容(MLCC)
  • 容值: 1nF
  • 材质(温度系数): X7R
  • 精度: ±10%
  • 额定电压: 50V
  • 封装: 0805

3. 详细描述

3.1 容值与精度

TCC0805X7R102K500DTS 的标称容值为 1nF,精度为 ±10%。这意味着在实际应用中,电容的容值可以在 0.9nF 到 1.1nF 之间波动。这种精度水平适用于大多数通用电路设计,能够满足一般的滤波、耦合和旁路等应用需求。

3.2 材质与温度系数

该电容采用 X7R 材质,具有较宽的工作温度范围和稳定的温度特性。X7R 材质的温度系数为 ±15%,在 -55°C 到 +125°C 的温度范围内,电容的容值变化不超过 ±15%。这种特性使得 TCC0805X7R102K500DTS 能够在各种环境条件下保持稳定的性能,适用于温度变化较大的应用场景。

3.3 额定电压

TCC0805X7R102K500DTS 的额定电压为 50V,这意味着它可以在不超过 50V 的电压下正常工作。这种电压等级适用于大多数低电压电路设计,如电源滤波、信号耦合等应用。

3.4 封装尺寸

该电容采用 0805 封装,尺寸为 2.0mm x 1.25mm。这种小型化封装使得 TCC0805X7R102K500DTS 能够适应现代电子设备对空间的高效利用需求,特别适用于高密度 PCB 设计。

4. 应用领域

TCC0805X7R102K500DTS 广泛应用于以下领域:

  • 消费电子: 如智能手机、平板电脑、笔记本电脑等设备中的滤波、耦合和旁路电路。
  • 通信设备: 如基站、路由器、交换机等设备中的信号处理和电源管理电路。
  • 工业控制: 如 PLC、传感器、电机控制等设备中的滤波和稳压电路。
  • 汽车电子: 如车载娱乐系统、导航系统、发动机控制单元等设备中的滤波和耦合电路。

5. 品牌与质量保证

TCC0805X7R102K500DTS 由 CCTC(三环)公司生产,该公司在电子元器件领域具有丰富的经验和技术积累。CCTC 的产品以高可靠性和稳定性著称,广泛应用于全球各大电子设备制造商。该电容经过严格的质量控制和测试,确保其在各种应用场景下的可靠性和耐久性。

6. 总结

TCC0805X7R102K500DTS 是一款高性能的贴片多层陶瓷电容,具有 1nF 的容值、±10% 的精度、50V 的额定电压和 0805 的封装尺寸。其采用 X7R 材质,具有较宽的工作温度范围和稳定的温度特性,适用于消费电子、通信设备、工业控制和汽车电子等多个领域。CCTC(三环)公司的高品质保证使得该电容在各种应用场景下都能表现出色,是现代电子设备设计中不可或缺的元器件之一。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.