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CCTC TCC0402C0G100J500AT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- CCTC TCC0402C0G100J500AT
- Type
- CCTC
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- CCTC
- Electronic Component
- TCC0402C0G100J500AT
- Electronic Component
- 1
- Electronic Component
- 10pF
- Package
- 0402
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±5%
- Electronic Component
- 0.012g
- Electronic Component
- 1
- Electronic Component
- BM0265085204
- Electronic Component
- C0G
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TCC0402C0G100J500AT 产品概述
一、产品简介
TCC0402C0G100J500AT 为 CCTC（三环）公司生产的一款贴片多层陶瓷电容（MLCC），标称容量 10 pF，公差 ±5%（J），额定电压 50 V，介质类型为 C0G（又称 NP0），封装尺寸为 0402（约 1.0 mm × 0.5 mm）。本产品面向高频、精密时基和低损耗电路，兼顾体积最小化与电性能稳定性。
二、主要特性
- 容值：10 pF ±5%（J）
- 额定电压：50 V DC
- 介质：C0G（Class 1），温度系数接近 0 ppm/°C，温度稳定性优良
- 封装：0402（1005 公制尺寸），适用于高密度贴装
- 低介质损耗、低漏电、良好自谐频率特性，适合 GHz 级应用
- 符合无铅/RoHS 要求，采用带卷包装，适配自动贴片生产线
三、典型应用场景
- 高频滤波、阻抗匹配与射频前端电路
- 振荡器、时钟与频率控制回路（对温漂要求高的场合）
- 精密模拟电路中的耦合与旁路（需稳定电容值）
- 医疗、通信、精密测量仪器和无线模块等体积受限的设备
四、封装与可靠性建议
- 建议采用 IPC 推荐的贴片焊盘和回流焊工艺，符合 J-STD-020 回流曲线（无铅工艺峰值约 260 °C）
- 对焊接应力敏感，印刷与贴装时避免基板剧烈弯曲或强力擦拭焊点区域
- 推荐在可预见的使用温度范围内（通常 -55 °C 至 +125 °C）工作，以发挥 C0G 的温度稳定性
- 存储与运输采用干燥包装以避免潮气引起的机械损伤
五、选型与替代建议
若系统对温度稳定性与低损耗要求极高，C0G 为首选；若需更大容量或更高电压，可考虑同系列不同容值/电压的 0402 或更大封装型号。选型时请同时关注自谐频率、电感影响及系统布局对有效电容的影响。
六、包装与订购信息
标准提供卷带（Tape & Reel）包装，适配自动贴装机。订购或批量需求请注明型号：TCC0402C0G100J500AT、所需数量与包装方式，以便提供具体交货期与技术资料。
如需完整的电气规格表（等效串联电阻、绝缘电阻、介质损耗、温度系数曲线及尺寸公差图），可提供样品测试报告或索取数据手册。
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