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CCTC TCC1206X7R202K102FT
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- CCTC TCC1206X7R202K102FT
- Type
- CCTC
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- CCTC
- Electronic Component
- TCC1206X7R202K102FT
- Electronic Component
- 1
- Electronic Component
- 2nF
- Package
- 1206
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.05g
- Electronic Component
- 1
- Electronic Component
- BM0265001222
- Electronic Component
- X7R
- Voltage
- 1kV
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CCTC1206X7R202K102FT 贴片多层陶瓷电容（MLCC）产品概述
一、产品基本定位
CCTC1206X7R202K102FT是三环电子（CCTC） 推出的高压通用型MLCC，针对中等功率高压场景设计，兼顾容值稳定性与成本优势。产品采用1206（英制）/3216（公制）表面贴装封装，适配自动化贴装工艺，可广泛应用于开关电源、LED驱动、工业控制等领域。
二、核心技术参数
参数项 具体规格 说明 容值 2nF（2000pF） 容值编码：202（20×10²pF） 容值精度 ±10%（K级） 满足90%以上通用电路的精度需求 额定电压 1kV（直流） 电压编码：102（10×10²V），可承受短期过压 温度系数 X7R（EIA标准） 工作温度范围：-55℃~+125℃，容值变化≤±15% 封装尺寸 1206（英制）/3216（公制） 长3.2mm×宽1.6mm×厚0.8mm（典型值） 损耗角正切值（tanδ） ≤0.015（1kHz，25℃） 高频损耗低，适合滤波/耦合应用 环保认证 RoHS 2.0、REACH 无铅无镉，符合欧盟环保指令三、材料与关键特性
1. X7R介质材料优势
X7R是MLCC中高介电常数（εr≈2000~4000） 的典型介质，平衡了容值密度与温度稳定性：
- 宽温范围内（-55℃~125℃）容值变化小，避免电路参数漂移；
- 介电常数高于NPO（COG），相同封装下可实现更大容值；
- 耐电压性能优于Y5V等低压介质，适配1kV高压场景。
2. MLCC结构可靠性
采用多层陶瓷叠层+镍内电极 结构：
- 内电极与陶瓷介质烧结兼容性好，减少分层风险；
- 端电极采用“镍+锡”镀层，焊接附着力强，回流焊后无脱落问题；
- 无极性设计，贴装时无需区分正反，提高生产效率。
3. 高压应用适配性
1kV额定电压覆盖开关电源高压侧（输出/输入滤波）、LED驱动PFC电路 等场景，可承受电路中的瞬态尖峰电压（如开关管关断时的电压浪涌），同时2nF容值适合滤除10kHz~100MHz频段的高频噪声。
四、典型应用场景
- 开关电源：高压输出滤波电容，替代电解电容实现高频噪声抑制；
- LED驱动电源：PFC电路的耦合/滤波电容，适配100~200W中功率驱动；
- 工业控制：变频器、PLC的控制电路耦合电容，应对-20℃~+85℃的工作环境；
- 医疗设备：低功率高压电路（如诊断设备信号传输）的滤波元件，符合环保要求；
- 通信电源：基站电源模块的EMI滤波，减少电磁干扰对信号的影响。
五、品牌与质量保障
三环电子（CCTC）是国内MLCC行业的骨干企业，产品通过：
- ISO9001质量管理体系认证；
- 部分系列通过AEC-Q200汽车级认证（本型号可定制汽车级版本）；
- 可靠性测试：高温寿命（125℃/1kV×1000h，容值变化≤±10%）、湿度测试（85℃/85%RH×1000h，无失效）。
六、封装与贴装注意事项
- 封装尺寸：3.2mm×1.6mm×0.8mm（典型值），焊盘间距符合IPC-7351标准；
- 焊接温度：回流焊峰值温度≤245℃（无铅工艺），波峰焊温度≤260℃；
- 存储条件：常温（25℃±5℃）、湿度≤60%，开封后1个月内使用完毕（避免端电极氧化）。
该产品以高性价比、稳定的性能适配中高压通用电路，是替代进口同类产品的优质选择。
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