WMSIC Electronic Components

CCTC TCC0603X5R226M6R3CT

ModelTCC0603X5R226M6R3CT
Package0603
BrandCCTC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
CCTC TCC0603X5R226M6R3CT
Type
CCTC
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CCTC
Electronic Component
TCC0603X5R226M6R3CT
Electronic Component
1
Electronic Component
22uF
Package
0603
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±20%
Electronic Component
0.048g
Electronic Component
1
Electronic Component
BM0265124344
Electronic Component
X5R
Voltage
6.3V
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TCC0603X5R226M6R3CT 多层陶瓷贴片电容产品概述

一、产品基本信息

TCC0603X5R226M6R3CT是三环电子(CCTC) 推出的通用型多层陶瓷贴片电容(MLCC),属于X5R温度特性系列,专为低电压、中等容值需求的电子电路设计。型号命名遵循行业标准:“0603”为封装尺寸,“X5R”为温度系数,“226”对应22μF容值,“M”代表±20%精度,“6R3”为6.3V额定电压,是消费电子、小型工业设备等领域的高性价比选型。

二、关键性能参数

  1. 容值与精度:标称容值22μF(由“226”编码转换:22×10⁶ pF=22μF),精度±20%,满足多数通用电路对容值偏差的要求;
  2. 额定电压:直流额定电压6.3V,适用于3.3V、5V等低电压供电系统(需留电压余量);
  3. 温度特性:X5R温度系数,工作温度范围**-55℃至+85℃**,容量变化率≤±15%,宽温环境下性能稳定;
  4. 无极性设计:无需区分正负极,简化电路布线与焊接操作,适配各类电路拓扑。

三、封装与物理特性

  1. 封装尺寸:采用0603英制贴片封装,对应公制尺寸为1.6mm(长)×0.8mm(宽),体积紧凑,适合高密度PCB布局;
  2. 厚度:标称厚度0.8mm,兼容常规SMT生产线贴装要求,可适配超薄PCB设计;
  3. 材料结构:陶瓷介质+镍电极/银电极复合结构,具备良好绝缘性、高频响应与抗干扰能力。

四、典型应用场景

该电容因参数均衡、体积小巧,广泛覆盖以下场景:

  1. 消费电子:智能手机、平板电脑的电源滤波(电池供电回路去耦)、音频电路耦合;
  2. 小型家电:智能遥控器、WiFi插座、小型加湿器的信号滤波与电源稳压;
  3. 工业控制:小型传感器模块(温度、湿度传感器)辅助电路、低功耗PLC电源去耦;
  4. 汽车电子:低功耗车载设备(行车记录仪、胎压监测模块)辅助电路(部分批次可满足汽车级认证要求)。

五、品牌与可靠性优势

  1. 品牌背书:三环电子(CCTC)是国内MLCC主流厂商,产品通过ISO9001、RoHS2.0、REACH等认证,环保无铅;
  2. 可靠性验证:经过高温老化(125℃×1000h)、湿度循环(85℃/85%RH×500h)、振动测试(10-2000Hz×20h),批次一致性达行业领先水平;
  3. 供应稳定性:具备年产能超10亿只的规模化生产能力,可满足中小批量至大批量采购需求。

六、选型与使用注意事项

  1. 电压余量:实际工作电压需低于额定电压的80%(即≤5V),避免过压导致电容击穿;
  2. 温度匹配:若应用环境温度超过85℃,需更换X7R(-55℃~+125℃)或更高温度特性的电容;
  3. 焊接工艺:回流焊峰值温度≤260℃,焊接时间≤30s,避免热应力损坏陶瓷介质;
  4. 存储要求:常温(25℃±5℃)、干燥(湿度≤60%)环境存储,开封后1个月内使用完毕,避免吸潮影响焊接质量。

该产品以高性价比、稳定性能适配多数通用电路需求,是电子设计中低电压中等容值场景的可靠选择。

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