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TCC0805X7R331K500DT 是一款由 CCTC(三环)公司生产的贴片多层陶瓷电容(MLCC),广泛应用于各种电子设备中,用于滤波、耦合、旁路等电路功能。该电容具有高可靠性、优异的温度稳定性和良好的电气性能,适用于多种工业和消费电子产品。
TCC0805X7R331K500DT 的标称容值为 330pF,精度为 ±10%。这意味着在实际应用中,电容的容值可以在 297pF 到 363pF 之间波动。这种精度适用于大多数通用电路设计,尤其是在对容值要求不是特别严格的场合。
该电容采用 X7R 材质,具有较宽的温度稳定性范围。X7R 材质的温度系数为 ±15%,在 -55°C 到 +125°C 的温度范围内,容值变化不超过 ±15%。这使得 TCC0805X7R331K500DT 能够在各种环境温度下保持稳定的电气性能,适用于工业和汽车电子等严苛环境。
TCC0805X7R331K500DT 的额定电压为 50V,这意味着它可以在不超过 50V 的直流电压下长期稳定工作。对于大多数低电压应用,如消费电子和通信设备,50V 的额定电压提供了足够的安全裕量。
该电容采用 0805 封装,尺寸为 2.0mm x 1.25mm。0805 封装是一种常见的贴片电容尺寸,适用于高密度 PCB 布局,能够有效节省电路板空间,同时便于自动化贴装。
TCC0805X7R331K500DT 适用于多种电子设备和电路,包括但不限于:
CCTC(三环)是一家知名的电子元器件制造商,以其高质量和可靠性著称。TCC0805X7R331K500DT 经过严格的质量控制和测试,确保其在各种应用场景下的稳定性和耐久性。
TCC0805X7R331K500DT 是一款高性能的贴片多层陶瓷电容,具有 330pF 的容值、±10% 的精度、50V 的额定电压和 X7R 材质的温度稳定性。其 0805 封装尺寸适合高密度 PCB 布局,广泛应用于消费电子、工业控制、汽车电子和通信设备等领域。CCTC(三环)的品牌保证和严格的质量控制,使得该电容成为工程师和设计师的理想选择。
通过以上详细的产品概述,用户可以全面了解 TCC0805X7R331K500DT 的性能特点和应用场景,从而更好地选择和使用该产品。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
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The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
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The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
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Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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