Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
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TCC0805X7R105K250DT 是一款由 CCTC(三环)公司生产的贴片多层陶瓷电容(MLCC),广泛应用于各种电子设备中,用于滤波、耦合、旁路等电路功能。该电容具有高可靠性、优良的温度稳定性和紧凑的封装尺寸,适用于高密度电路板设计。
3.1 容值与精度 TCC0805X7R105K250DT 的标称容值为 1uF,精度为 ±10%。这意味着在实际应用中,电容的容值可能在 0.9uF 到 1.1uF 之间波动。这种精度适用于大多数通用电子电路,尤其是在对容值要求不是特别严格的场合。
3.2 材质与温度系数 该电容采用 X7R 材质,具有优良的温度稳定性。X7R 表示在 -55°C 到 +125°C 的温度范围内,电容的容值变化不超过 ±15%。这种特性使得 TCC0805X7R105K250DT 适用于各种环境温度变化较大的应用场景,如汽车电子、工业控制等。
3.3 额定电压 TCC0805X7R105K250DT 的额定电压为 25V,这意味着在正常工作条件下,电容可以承受的最大电压为 25V。超过这个电压可能会导致电容损坏或性能下降。因此,在设计电路时,应确保工作电压不超过额定电压。
3.4 封装尺寸 该电容采用 0805 封装,尺寸为 2.0mm x 1.25mm。这种紧凑的封装尺寸使得 TCC0805X7R105K250DT 非常适合高密度电路板设计,尤其是在空间受限的便携式电子设备中。
TCC0805X7R105K250DT 广泛应用于各种电子设备中,包括但不限于:
TCC0805X7R105K250DT 由 CCTC(三环)公司生产,CCTC 是一家知名的电子元器件制造商,以其高质量和可靠性著称。该产品经过严格的质量控制和测试,确保在各种应用场景下都能稳定工作。
TCC0805X7R105K250DT 是一款高性能的贴片多层陶瓷电容,具有 1uF 的容值、±10% 的精度、25V 的额定电压和 0805 的封装尺寸。其 X7R 材质提供了优良的温度稳定性,适用于各种环境温度变化较大的应用场景。CCTC 的品牌保证确保了产品的高质量和可靠性。无论是消费电子、汽车电子、工业控制还是通信设备,TCC0805X7R105K250DT 都是一个理想的选择。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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