WMSIC Electronic Components

CCTC TCC0603X7R154K500CT

ModelTCC0603X7R154K500CT
Package0603
BrandCCTC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
CCTC TCC0603X7R154K500CT
Type
CCTC
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CCTC
Electronic Component
TCC0603X7R154K500CT
Electronic Component
1
Electronic Component
150nF
Package
0603
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.035g
Electronic Component
1
Electronic Component
BM0264381442
Electronic Component
X7R
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TCC0603X7R154K500CT 贴片多层陶瓷电容(MLCC)产品概述

一、产品基本信息

TCC0603X7R154K500CT是三环电子(CCTC) 推出的0603封装贴片多层陶瓷电容(MLCC),属于X7R温度特性系列。该产品针对常规电子电路的滤波、耦合、去耦需求设计,兼具小尺寸、宽温稳定、高可靠性等特点,广泛适配消费电子、工业控制、汽车辅助电子等领域。

二、核心参数及技术意义

  1. 容值与精度:标称容值150nF(标识“154”,即15×10⁴pF),精度±10%(标识“K”)。±10%的精度平衡了成本与性能,满足绝大多数常规电路的匹配需求,无需额外校准。
  2. 额定电压:50V直流额定电压,实际工作电压建议不超过40V(留80%裕量),可应对电源纹波、瞬时过压等场景,适配5V/12V/24V等主流低压系统。
  3. 温度系数X7R:温度范围为-55℃~+125℃,容值变化率±15%。相比Y5V(容值变化大)更稳定,相比NPO(高频稳定但容值密度低)更适合中容值需求,适合宽温环境应用。

三、封装与工艺特性

  1. 0603封装:英制0603(公制1608,尺寸1.6mm×0.8mm),贴片式设计适配SMT自动化生产,支持高密度PCB布局,满足智能手机、智能穿戴等小型化设备需求。
  2. MLCC叠层工艺:采用多层陶瓷介质叠层+镍内电极(无铅环保),容值密度高(小封装实现150nF中容值),无电解液干涸问题,寿命远长于电解电容。
  3. 环保合规:符合RoHS 2.0、REACH等国际环保标准,无铅无镉,适合出口产品及绿色制造需求。

四、典型应用场景

  1. 电源滤波:开关电源的输入/输出滤波,150nF容值适配10kHz~100MHz频段,有效滤除中高频纹波;线性电源的稳压后滤波,提升输出电压稳定性。
  2. 数字电路去耦:CPU、FPGA等数字IC的电源引脚旁去耦,滤除IC开关过程中的高频噪声,避免串扰影响信号完整性。
  3. 模拟电路耦合:音频放大器、运放电路的级间信号耦合,X7R的宽温特性保证不同温度下信号传输稳定。
  4. 工业控制:PLC模块、传感器信号调理电路的滤波/耦合,适配工业现场-20℃~+60℃的温度变化。
  5. 汽车辅助电子:车载音响、中控屏幕的电源滤波,符合车载-40℃~+85℃的环境要求(低于X7R上限,性能稳定)。

五、质量与可靠性保障

  1. 品牌背书:三环电子(CCTC)是国内MLCC主流制造商,产能稳定,产品通过ISO 9001/TS 16949等质量体系认证。
  2. 可靠性测试:经过高温存储(125℃×1000h)、温度循环(-55℃~+125℃×1000次)、耐湿试验(85℃/85%RH×1000h)等严苛测试,失效率符合J-STD-020标准。
  3. 供货能力:常规型号库存充足,月产能稳定,可支持小批量定制(如调整精度、电压等级)。

六、使用注意事项

  1. 电压裕量:实际工作电压≤额定电压的80%(≤40V),避免长期过压导致介质老化、击穿。
  2. 温度限制:工作温度不超过125℃,否则容值变化超差可能影响电路性能。
  3. 焊接工艺:回流焊峰值温度230~240℃,时间≤10s;手工焊接温度≤350℃,时间≤3s,避免高温损坏陶瓷层。
  4. 机械应力:焊接后避免PCB剧烈弯曲(弯曲半径≥5mm),防止陶瓷电容开裂。
  5. 静电防护:MLCC对静电敏感,操作时需佩戴防静电手环,使用防静电包装/工作台。

该产品以高性价比、稳定性能成为常规电子电路的优选MLCC,适配多场景需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.