WMSIC Electronic Components

CCTC TCC0805COG470J501BT

ModelTCC0805COG470J501BT
Package0805
BrandCCTC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
CCTC TCC0805COG470J501BT
Type
CCTC
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CCTC
Electronic Component
TCC0805COG470J501BT
Electronic Component
1
Electronic Component
47pF
Package
0805
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±5%
Electronic Component
0.068g
Electronic Component
1
Electronic Component
BM0265398130
Electronic Component
C0G
Voltage
500V
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TCC0805COG470J501BT 贴片电容产品概述

TCC0805COG470J501BT是CCTC(三环)电子推出的多层贴片陶瓷电容(MLCC),聚焦高稳定、中高压电路需求,适配0805小型化封装,是工业控制、通信设备及消费电子领域的常用基础元件。

一、产品核心身份与定位

该电容属于CCTC的C0G(NPO)系列,以“高精度、低损耗、温度稳定性优异”为核心特点,针对对容值漂移敏感、耐压要求达500V的场景设计,替代传统电容的同时满足电路小型化趋势,是射频、振荡、滤波等高频电路的优选元件。

二、关键参数详细说明

  1. 容值与精度:标称容值47pF,精度±5%(编码“J”对应),无极性设计,容值随时间、电压变化极小,适合需要稳定匹配的电路;
  2. 额定电压:直流额定电压500V,可满足中等强度高压信号的耦合、滤波需求,避免过压击穿风险;
  3. 温度系数:C0G(NPO),工作温度范围-55℃~+125℃,容值变化≤±30ppm/℃,是目前陶瓷电容中温度稳定性最优的系列之一;
  4. 封装与尺寸:0805英寸(公制2.0mm×1.2mm),厚度0.6mm,适配常规PCB焊盘布局,支持高密度电路设计。

三、材料与结构特性

该电容采用钛酸钡基高稳定陶瓷介质,搭配银钯合金电极,多层叠层结构(MLCC)设计:

  • 低损耗:高频下ESR(等效串联电阻)极低,Q值(品质因数)高,适合射频信号传输;
  • 抗老化:陶瓷介质无极化效应,容值长期稳定,无电解电容的“老化衰减”问题;
  • 耐温性:介质材料可承受宽温范围,满足工业级环境(-40℃~+85℃)及极端温度测试。

四、典型应用场景

  1. 通信设备:射频前端滤波电路、晶体振荡器(XO)的容值匹配、蓝牙/WiFi模块的信号耦合;
  2. 工业控制:PLC(可编程逻辑控制器)的高压信号隔离、传感器接口的滤波补偿;
  3. 消费电子:高端电源的EMI滤波、液晶显示驱动的高频补偿、音频设备的信号耦合;
  4. 汽车电子:车载通信模块(如CAN总线)的信号滤波、仪表盘电路的稳定匹配(部分批次支持车规级测试)。

五、品牌可靠性支撑

CCTC(三环)是国内老牌电子元器件制造商,该电容符合RoHS 2.0、REACH环保标准,通过ISO9001质量体系认证,且经过以下可靠性测试:

  • 高温老化测试:125℃下1000小时,容值变化≤±1%;
  • 耐湿测试:85℃/85%RH下1000小时,无性能衰减;
  • 机械强度测试:振动(10~2000Hz)、冲击(100g)测试,封装无开裂。

六、封装与工艺兼容性

0805封装适配常规PCB焊盘(通常焊盘尺寸2.4mm×1.6mm),支持回流焊、波峰焊工艺:

  • 回流焊温度曲线:峰值温度245℃±5℃,时间≤10秒;
  • 波峰焊温度:峰值250℃±5℃,时间≤5秒;
  • 引脚间距适配:可兼容现有0805封装的电路设计,无需额外调整布局。

该电容凭借高稳定性、中高压能力及小型化优势,成为多领域电路设计的可靠选择,适用于对性能要求严格的量产场景。

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