WMSIC Electronic Components

CBI SS8550

ModelSS8550
PackageSOT23
BrandCBI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
CBI SS8550
Type
CBI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CBI
Electronic Component
SS8550
Electronic Component
1
Package
SOT23
Electronic Component
1 PNP
Electronic Component
Transistor(BJT)
Electronic Component
0.037g
Electronic Component
1
Electronic Component
BM0228585545
Transistor Type
PNP
Frequency(f T)
100MHz
Power Dissipation(Pd)
300mW
Electronic Component
Electronic Component
Electronic Component
3000
Collector Current(Ic)
1.5A

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SS8550 产品概述

一、产品简介

SS8550 是一款面向中低压、中等电流应用的 PNP 双极型晶体管,由 CBI(创基)生产,常见封装为 SOT-23。器件适用于开关、放大和驱动场合,具有较高的直流电流增益和较宽的工作频带,可在低电压微系统中作为高端开关或放大级使用。

二、主要参数特性

  • 晶体管类型:PNP(小信号/中等电流)
  • 集电极电流 Ic:1.5A(最大)
  • 集射极击穿电压 Vceo:25V(最大)
  • 耗散功率 Pd:500mW(器件在标准条件下的允许功耗,实际以封装散热和PCB布局为准)
  • 直流电流增益 hFE:120 @ Ic=100mA, VCE=1V(典型)
  • 特征频率 fT:100MHz(表示高频性能良好)
  • 集电极截止电流 Icbo:100nA(低漏电)
  • 集-射饱和电压 VCE(sat):约500mV(在大电流条件下测得,测试条件可能为 Ic=800mA、IB≈80mA,请以下游数据表为准)
  • 发-基极反向击穿 Vebo:5V(注意基极-发射极反向电压容限较低)

三、封装与引脚

  • 封装:SOT-23,体积小,便于贴片组装。
  • 常见引脚排列(出厂资料可能略有差异,请以具体数据表为准):1—基极(B),2—发射极(E),3—集电极(C)。
  • 单片数量:1个(可按需采购卷带或托盘包装)。

四、典型应用

  • 低电压系统的高端开关(如电源管理中的正极侧开关)
  • 放大器的前置或驱动级(小信号放大、音频前级)
  • 继电器、蜂鸣器等负载的驱动(中等电流场合)
  • 与 NPN 互补构成推挽级或 Sziklai 补偿对

五、使用建议与注意事项

  • Vebo 较低(5V),在电路设计和调试时避免对基极施加过大的反向电压,以防损坏。
  • 饱和导通时需给足够基极电流:虽然 hFE 在小电流时较高,但在饱和区 hFE 会显著下降。若要求低 VCE(sat),一般按 IB≈IC/10 ~ IC/20 来设计驱动电路;例如高流 Ic=800mA 时,驱动基流可能需要数十 mA(请结合实际数据表和驱动能力确认)。
  • 热管理:器件耗散功率为 500mW,但实际允许功耗受 PCB 铜箔面积和环境温度影响。高电流或持续导通场合应增大铜箔面积或添加散热措施,并考虑额定功耗随温度线性降额。
  • 高频性能(fT≈100MHz)使其在开关速度和小信号放大中表现良好,但在高频高功率场合仍需注意寄生和布局。

六、可靠性与选型建议

  • 对于需要稳定低漏电和良好增益的中低压设计,SS8550 是性价比较高的选择。
  • 在选型时,请参考厂商完整数据表以获取典型测试条件(VCE、IB、温度)和极限参数,特别是 VCE(sat) 的测试条件与 Pd 的热阻数据。
  • 对于长期高电流或高功耗应用,建议选择更大封装或额外散热措施以保证长期可靠性。

如需电气原理图示例、参考 PCB 布局或与常见 NPN 器件的配对建议,我可以根据具体应用场景提供更详细的设计指导。

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