Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
CBI BAV199S
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- CBI BAV199S
- Type
- CBI
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- CBI
- Electronic Component
- BAV199S
- Electronic Component
- 1
- Package
- SOT-23
- Electronic Component
- Switch Diode
- Electronic Component
- 0.031g
- Electronic Component
- 1
- Electronic Component
- BM0264379719
- Current
- 140mA
- Diode
- 1
- Current(Ir)
- 30nA@75V
- (Vf)
- 1.25V@150mA
- Power Dissipation(Pd)
- 250mW
- Electronic Component
- 65℃~+150℃
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BAV199S（CBI 创基）产品概述
一、产品简介
BAV199S 是创基（CBI）推出的一款双二极管串联封装（1 对串联式）、SOT-23 小封装的开关/整流二极管器件。器件面向小信号、高耐压、低漏电流场合，具有较高的反向耐压和快速恢复特性，适用于便携式电子、信号整形、保护与高压小电流路径的应用。
二、主要电气参数
- 耗散功率 (Pd)：250 mW
- 直流整流电流（推荐工作电流）：140 mA
- 直流反向耐压（Vr）：85 V
- 正向压降（Vf）：典型 1.25 V @ 150 mA
- 非重复峰值浪涌电流（Ifsm）：4 A
- 反向电流（Ir）：30 nA @ 75 V
- 反向恢复时间（Trr）：3 μs
- 工作结温范围：-65 ℃ ~ +150 ℃
- 封装：SOT-23（小体积、适合自动贴装）
三、产品特性与优势
- 高反向耐压（85 V）满足多数中高压小信号场合的要求。
- 极低的反向漏电（30 nA @ 75 V）非常适合高阻抗输入或微弱信号路径，能有效减小静态泄漏引起的误差。
- 较低的正向压降在中等电流下仍能保持较小功耗，有利于电压基准或整流应用。
- 快速恢复时间（3 μs）适合一般开关与信号整形，但非超高速逻辑开关场合（非高速肖特基级别）。
- SOT-23 封装体积小，便于在空间受限的电路板上实现双二极管功能。
四、典型应用场景
- 信号整形与电平移位
- 输入/输出端口的过压或反向保护
- 小电流整流与钳位电路
- 测试与测量设备中高阻抗信号路径的反向防护
- 开关电路、混频器及检波电路中的双二极管配置
五、设计与使用建议
- 由于器件耗散功率为 250 mW，长期工作电流建议不超过额定 140 mA，并在设计时考虑功耗和结温升高的影响；必要时在 PCB 上增加铜箔散热面积以降低结温。
- 正向压降以 150 mA 测试为准，实际电路中若使用更小电流，Vf 会相应减小；在做电压精度预算时应以实际工作电流下的 Vf 为准。
- 峰值浪涌 Ifsm 可承受短时脉冲，但不能代替专用浪涌保护元件；长时间或重复性大脉冲会损耗器件寿命。
- 反向漏电随温度显著上升，在高温工作条件下需留有余量以避免误触发或偏移。
六、可靠性与选型注意
- 工作结温范围宽（-65 ℃ 到 +150 ℃），适合工业级与宽温度应用，但在极限温度下参数会变化，应参考数据手册的温度特性曲线。
- 选型时确认封装型号（SOT-23）与印刷标识，批次间参数可能有微小差异，批量生产建议要求供应商提供器件测试报告或样品验证。
七、小结
BAV199S（CBI 创基）以其高耐压、低漏电、紧凑 SOT-23 封装及适中的开关性能，适合用于高阻抗保护、信号钳制与小电流整流等多种场合。合理的电流和热管理设计可确保长期稳定运行。若需进一步电气特性曲线、封装尺寸或典型应用电路，建议参考厂商完整数据手册或向供应商咨询样品测试。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
