WMSIC Electronic Components

CBI RB521S-30 RB521S

ModelRB521S-30
PackageSOD-523
BrandCBI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
CBI RB521S-30
Type
CBI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CBI
Electronic Component
RB521S-30
Electronic Component
1
Package
SOD-523
Electronic Component
Schottky Diode
Electronic Component
0.025g
Electronic Component
1
Electronic Component
BM0229963304
Current
200mA
Diode
Electronic Component
Current(Ir)
30uA@10V
(Vf)
500mV@200mA
Electronic Component
Electronic Component
Electronic Component
3000
Voltage Rating(Vr)
30V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

RB521S-30 产品概述

一、产品简介

RB521S-30 是创基(CBI)推出的一款独立式肖特基二极管,采用超小型 SOD-523 封装,专为低压、低功耗场合设计。该器件正向压降低(Vf = 500 mV @ 200 mA)、额定直流整流电流为 200 mA,反向耐压 30 V,适用于便携设备电源保护与低压整流等场景。

二、主要技术参数

  • 件型号:RB521S-30
  • 品牌:CBI(创基)
  • 封装:SOD-523(独立式)
  • 正向压降:≈ 500 mV @ IF = 200 mA
  • 直流整流电流:200 mA
  • 直流反向耐压(Vr):30 V
  • 反向电流(Ir):30 µA @ VR = 10 V
  • 非重复峰值浪涌电流(Ifsm):1 A

三、产品特性与优势

  • 低正向压降:在 200 mA 工作点下约 0.5 V,可显著降低整流与开关损耗,提升系统效率。
  • 小型封装:SOD-523 占板面积小,适合空间受限的移动设备与高密度 PCB 布局。
  • 低漏电:10 V 时反向电流典型值 30 µA,有利于待机功耗优化。
  • 合理的浪涌能力:1 A 峰值浪涌可应对短时冲击电流和通电瞬态。

四、典型应用场景

  • 移动电源、便携式多媒体设备的电源整流与隔离。
  • USB/Type-C 电源路径防反接与续流保护。
  • 低压开关电源(SMPS)和DC-DC 转换器的输出整流/续流二极管(小电流级)。
  • 电池管理与电源路径选择(OR-ing),以及低压快速切换电路。
  • 高频整流与检波电路(得益于肖特基低恢复特性)。

五、封装与安装要点

SOD-523 为超小型表贴封装,焊盘尺寸与热阻受限。建议:

  • 使用厂家推荐的 PCB 焊盘布局,保持热源附近短且宽的铜箔以利散热。
  • 尽量缩短与电源轨的走线,减少寄生电阻和压降。
  • 回流焊工艺需按焊料和回流曲线规范操作,避免过度热循环损伤器件。

六、使用建议与注意事项

  • 关注电流与温度的并行影响:在高环境温度或长期 200 mA 工作时应进行电流热降额设计,避免超过结温极限(详见原厂数据手册)。
  • 反向电压余量:设计时留有一定 Vr 余量,防止瞬态过压导致击穿。建议在有较大瞬态的环境下配合 TVS 或限压网络。
  • ESD 与焊接:小封装易受机械应力与不当焊接影响,贴装与回流请严格控管;在操作与测试时遵守静电防护规范。
  • 如需更高峰值浪涌或更高电流能力,请参考更大封装或并联方案,并验证热性能与电流分配。

七、选型与替代建议

RB521S-30 适合对空间、效率和静态漏电有较高要求的低压整流场合。如需更高耐压或更大电流,可考虑同类肖特基家族中 Vr 更高或封装更大的型号。选型时建议对照完整的厂商数据手册核对温度范围、功耗参数及封装图样,以确保电路长期可靠运行。

如需器件的详细电气特性曲线、热阻或 PCB 封装推荐图,请参阅 CBI(创基)官方数据手册或联系供应商获取原厂资料。

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