WMSIC Electronic Components

CBI RB551V-30 RB551V

ModelRB551V-30
PackageSOD-323
BrandCBI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
CBI RB551V-30
Type
CBI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CBI
Electronic Component
RB551V-30
Electronic Component
1
Package
SOD-323
Electronic Component
Schottky Diode
Electronic Component
0.026g
Electronic Component
1
Electronic Component
BM0228586164
Current
500mA
Diode
Electronic Component
Current(Ir)
100uA@20V
(Vf)
470mV@500mA
Electronic Component
Electronic Component
Electronic Component
3000
Voltage Rating(Vr)
30V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

RB551V-30 产品概述

一、产品简介

RB551V-30 是创基(CBI)推出的一款独立式肖特基整流二极管,采用 SOD-323 小封装。针对低压快速整流与保护场合优化,具有较低正向压降和中等电流能力,适合便携式与消费类电子的电源路径与保护电路。

二、主要电气参数

  • 型号:RB551V-30
  • 封装:SOD-323(独立式)
  • 正向压降:Vf = 470 mV @ 500 mA
  • 连续整流电流:500 mA
  • 非重复峰值浪涌电流:Ifsm = 2 A(一次性浪涌)
  • 直流反向耐压:Vr = 30 V
  • 反向电流:Ir = 100 µA @ 20 V
  • 品牌:CBI(创基)

三、主要特性与优势

  • 低压降:470 mV 在 500 mA 条件下的正向压降,有助于降低功耗和发热,尤其在低压供电(5 V 及以下)系统中提高效率。
  • 小体积封装:SOD-323 便于高密度 PCB 布局,适合空间受限的移动设备及小型模块。
  • 中等浪涌能力:2 A 的非重复峰值浪涌足以应对上电或瞬态冲击,但不适合长期承受高能量浪涌的场合。
  • 30 V 反向耐压:适用于 USB、移动电源、LCD 背光等低压应用,但不适合高压环境。

四、典型应用场景

  • 低压整流与二极管 ORing(电源取舍)
  • 反向极性保护与防回流
  • 开关电源输出整流(小功率)
  • 电池管理与充放电路径保护(小电流场合)
  • 信号线路保护与钳位

五、设计与布局注意事项

  • 热管理:SOD-323 封装散热受限,长期连续电流接近额定 500 mA 时应评估结温。建议在 PCB 上增加铜箔散热、短走线并避免与热源紧邻。
  • 反向漏电:100 µA@20 V 为室温条件下典型值,温度升高时漏电会显著增加,温度敏感电路请考虑影响或选用更低漏电型号。
  • 浪涌保护:Ifsm 为非重复峰值,应避免重复或长时间高能脉冲,必要时在输入端增加瞬态抑制器或限流元件。
  • 电压裕量:器件 Vr=30 V,请确保工作环境和过压事件不会超过该限制,若存在高压瞬态需外加 TVS 或更高 Vr 器件。

六、可靠性与采购建议

RB551V-30 适合体积受限、对效率有一定要求的低压应用。选型时应结合工作环境温度、最大连续电流与可能的浪涌能量进行热与电应力验证。采购时可向 CBI(创基)索取器件的可靠性报告与封装数据、及卷盘包装信息以便生产线贴装。若项目对反向漏电或耐浪涌有更高要求,可比较更高 Vr 或更低 Ir 的肖特基型号以做权衡。

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