Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
CBI MMBT3904T
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- CBI MMBT3904T
- Type
- CBI
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- CBI
- Electronic Component
- MMBT3904T
- Electronic Component
- 1
- Package
- SOT-523
- Electronic Component
- 1 NPN
- Electronic Component
- Transistor(BJT)
- Electronic Component
- 0.024g
- Electronic Component
- 1
- Electronic Component
- BM0221161393
- Transistor Type
- NPN
- Frequency(f T)
- 300MHz
- Power Dissipation(Pd)
- 150mW
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
- Collector Current(Ic)
- 200mA
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MMBT3904T 产品概述
一、基本信息
MMBT3904T 是一种常用的 NPN 型三极管，属于 BJT（双极型晶体管）类型。它的封装形式为 SOT-523-3，这是一种小型的表面贴装封装，适合在高密度电路中使用。该元器件广泛应用于信号放大、开关电路以及其他需要电流控制的场景。
二、关键规格
- 功耗：200mW
- 最大集电极-发射极电压 (Vce)：40V
- 最大集电极电流 (Ic)：150mA
- 封装：SOT-523-3
- 工作温度范围：-55℃至 +150℃
MMBT3904T 的设计具有相当高的工作稳定性和可靠性，同时其小型化的封装设计使其非常适合在空间受限的应用中使用。
三、特性与优势
高频响应：MMBT3904T 可以在较高频率下正常工作，相较于传统的三极管，这使得它更加适用于高频应用，比如射频放大器和数字电路。
小型化设计：SOT-523 封装极大地减小了电路板上的空间占用，便于高密度布线和微型化设计。对于便携式设备和消费电子产品尤其重要。
温度稳定性：广泛的工作温度范围使其能够适应不同环境条件下的工作需求，确保了在较为严苛的应用场景下的稳定性。
低饱和电压：MMBT3904T 的饱和电压较低，有效减少了功耗，提高了电路的能效比，特别在开关电路中，能够降低发热量。
四、应用场景
MMBT3904T 可以被广泛地应用于：
开关电路：用于信号控制和电源切换，与继电器和其他电子控制元件搭配使用。
放大电路：用于音频放大器和射频放大器，能够提供足够的增益，确保信号的完整性。
数字电路：适用于逻辑电路及与微控制器、单片机的接口设计。
传感器接口：常见于多种传感器中，负责信号放大的任务，以便发送到后续的处理单元。
五、安装与使用注意事项
在使用 MMBT3904T 时，建议关注以下几点：
引脚连接：确保根据数据手册连接正确的引脚，以避免故障。SOT-523 封装有三个引脚，分别为发射极、基极和集电极。
散热设计：虽然其功耗为 200mW，但在高负载条件下，仍需考虑散热问题，以免导致元器件过热和性能下降。
电流限制：须遵循其最大集电极电流和电压的规定，避免超出其额定值，以确保器件的长期稳定运行。
六、总结
MMBT3904T 是一款功能多样、应用广泛的 NPN 型三极管，以其出色的性能和小巧的封装设计，成为众多电子产品设计中不可或缺的元件之一。无论是用于开关还是放大应用，其可靠性和高效性都令其在现代电子行业中占据了一席之地。通过合理的设计和应用，它能够有效提升电路性能，为不同的设备提供稳定的电气支持。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
