WMSIC Electronic Components

Chilisin BMRB00060630100MA1

ModelBMRB00060630100MA1
PackageSMD,7.3x6.6mm
Brandchilisin
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
chilisin BMRB00060630100MA1
Type
CHILISIN
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CHILISIN
Electronic Component
BMRB00060630100MA1
Electronic Component
1
Package
SMD,7.3x6.6mm
Type
Magnetic Display Inductor
Electronic Component
Power Inductor
Electronic Component
±20%
Electronic Component
1.045g
Inductor
10uH
Electronic Component
1
Electronic Component
BM0263430896
Current
4A
Resistor(DCR)
68mΩ
Electronic Component
Electronic Component
Electronic Component
1000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BMRB00060630100MA1 产品概述

一、产品简介

BMRB00060630100MA1 为奇力新(chilisin)出品的磁胶屏蔽模制贴片电感,封装尺寸为 SMD 7.3 × 6.6 mm。该器件以低直流电阻和较高载流能力为设计目标,适用于开关电源滤波与能量储存场合,属于非标准定制件,适合对体积、电流与屏蔽特性有综合要求的电源应用。

二、主要参数

  • 电感值:10 µH,公差 ±20%
  • 额定电流(Ir):4.0 A(连续工作建议值)
  • 饱和电流(Isat):5.5 A(电感明显下降前的参考值)
  • 直流电阻(DCR):最大 68 mΩ
  • 类型:磁胶屏蔽、模制(屏蔽性与机械强度均佳)
  • 封装:SMD,尺寸 7.3 × 6.6 mm
  • 品牌:chilisin(奇力新)
  • 备注:非标准/定制型号,需按订单/样品确认最终规格和包装

三、性能特征与优点

  • 低 DCR 提升效率,减小功率损耗与发热,适合中高电流等级应用。
  • 较高的额定电流与饱和电流,保证在开关电源瞬态和负载波动时维持电感特性。
  • 模制屏蔽结构有效降低绕组与外部电路的磁干扰,便于在高密度 PCB 布局中使用。
  • SMD 结构利于自动贴装与回流焊接,提高制造良率与可靠性。

四、典型应用场景

  • 同步降压(Buck)与升压(Boost)模块的电感储能元件
  • DC-DC 转换器输出滤波
  • 电源管理模块与电机驱动前端滤波
  • 工业电源、消费电子电源与通信设备电源滤波场合

五、选型与使用建议

  • 连续工作电流应优先依据额定电流 4 A 进行热与电性能评估,对于长期满载使用建议留有裕量(通常 20–30%)。
  • 在接近 Isat 的工作点,电感值将发生明显下降,应避免长期工作于饱和区;若系统存在大电流脉冲,需核查瞬态电感变化对环路稳定性的影响。
  • 若对噪声和效率有更高要求,可结合器件的频率特性与实际测量曲线选择最合适的电感值与公差等级。
  • 由于为非标准定制件,采购前建议向厂商确认批量、交期、包装及相关可靠性测试报告。

六、PCB 布局与热管理要点

  • 将电感靠近开关器件或功率 MOSFET 的开关节点布置,缩短回流回路以降低 EMI。
  • 为降低温升,电感焊盘可设计为较大铜箔并通过热过孔连接到内层/底层散热铜箔。
  • 屏蔽结构有助于减少对附近敏感模拟信号的影响,但仍建议保留适当间距以避免热耦合。

七、可靠性与采购提示

  • 作为非标准型号,请向奇力新索取完整 datasheet、温升测试、长期老化及焊接工艺建议。
  • 在样机阶段进行电流、温度、噪声与寿命测试,验证在目标工况下的性能稳定性。
  • 批量采购时确认包装方式与防潮等级,确保 SMT 贴装时的可靠性。

如需更详细的频率响应、DC偏置曲线或样品与报价,可联系奇力新或指定代理商获取产品资料与工程支持。

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